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Multi-color-temperature COB (chip on board) light source and encapsulating method thereof

A packaging method and multi-color temperature technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as jumper collapse, external force applied by jumper, and influence on the yield of COB light sources, etc., to achieve the effect of increasing reliability

Pending Publication Date: 2018-07-06
NINGBO SUNPU OPTO SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the jumper is very fragile, and it is easy to exert external force on the jumper during the production and transportation of the COB light source, causing the jumper to collapse, break, etc., which will directly affect the yield of the COB light source

Method used

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  • Multi-color-temperature COB (chip on board) light source and encapsulating method thereof
  • Multi-color-temperature COB (chip on board) light source and encapsulating method thereof
  • Multi-color-temperature COB (chip on board) light source and encapsulating method thereof

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Embodiment Construction

[0041] The core of the invention is to provide a multi-color temperature COB light source. In the prior art, in the multi-color temperature COB light source, different conductive circuits are required for different color temperatures to control the LED chips with different color temperatures separately, which makes the circuit in the circuit board very complicated, and the circuit crossing often occurs. Condition. When the lines cross, it is usually necessary to expose two jumper points at the two ends of the cross in one of the lines, and then connect the two jumper points with gold wires by "bridge" to form a complete electrical circuit. Sometimes the jumper wire needs to be suspended on the circuit board. However, the jumper is very fragile, and it is easy to exert external force on the jumper during the production and transportation of the COB light source, causing the jumper to collapse and break, which will directly affect the yield rate of the COB light source and the ...

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Abstract

The invention discloses an encapsulating method of a multi-color-temperature COB (chip on board) light source. The method includes: welding inverted LED chips on default welding spots of a circuit board, and printing conductive silver slurry between jumper points of the circuit board to form a conductive silver slurry layer to form a complete conductive circuit. The printed conductive silver slurry can form the conductive silver slurry layer attached to the surface of the circuit board between the jumper points of the circuit board. Compared with a traditional suspending jumper structure, thestructure adopted in the method has the advantages that the conductive silver slurry layer is attached to the surface of the circuit board and has certain width, and the conductive silver slurry layeris more difficult to break than jumpers; the surface of the circuit board is free of structures of the jumpers, connecting lines and the like by the arrangement of the inverted LED chips, and influence of the jumper on the yield of the COB light source is completely avoided. The invention further provides the multi-color-temperature COB light source and has the same advantages as above mentioned.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a multi-color temperature COB light source and a packaging method thereof. Background technique [0002] With the continuous advancement of science and technology in recent years, people have higher and higher requirements for the quality of light sources. Among them, LED (Light Emitting Diode) is a new generation of light source. Its manufacturing process and packaging technology have made great progress. At the same time, more and more users choose LED light source as daily lighting equipment. The light source obtained by packaging LED chips on a circuit board through COB (chip on board) technology is also called a COB light source. [0003] At present, in the field of lighting, the demand for personalized lighting is particularly urgent. Businesses hope to show different effects of various illuminated objects through different lighting effects, and the corresponding mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L25/075
CPCH01L25/0753H01L33/48H01L33/62H01L2933/0066H01L2933/0033
Inventor 杜元宝张耀华蔡晓宁林胜张日光
Owner NINGBO SUNPU OPTO SEMICON
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