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A multi-surface synchronous bonding device for tile laying

A bonding device and paving technology, which is applied in the field of robots, can solve the problems of easy offset and difficult cleaning of tiles, and achieve the effect of simple and ingenious structure, perfect tile bonding, and efficient and synchronous bonding

Active Publication Date: 2020-03-17
永春县产品质量检验所福建省香产品质量检验中心国家燃香类产品质量监督检验中心福建
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pasting ceramic tiles on the wall is especially common in the house decoration process. When there are exposed water pipes on the wall, the exposed water pipes should be surrounded by ceramic tiles. At present, the commonly used method of pasting is to paste the corners of the three tiles with adhesive tape in advance. Position it, then use it to surround the water pipe, and then fill the gap between the tiles, water pipes and the wall with the mixture of cement and yellow sand from top to bottom. In the non-fixed state, it is easy to shift, and it is difficult to clean the tape when cleaning because the tape is directly pasted on the tile.

Method used

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  • A multi-surface synchronous bonding device for tile laying
  • A multi-surface synchronous bonding device for tile laying
  • A multi-surface synchronous bonding device for tile laying

Examples

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] see Figure 1-3 , the present invention provides a technical solution:

[0025] A multi-surface synchronous bonding device for tile laying, the arc frame 4 is a semicircular structure, the two ends of the arc frame 4 are fixed with sliding sleeves 3, and the arc frame 4 is sleeved on the column 2 through the sliding sleeve 3 , the column 2 is vertically fixed on the base 1, the middle part of the arc frame 4 is fixedly connected to the first brick clamping ...

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Abstract

The invention relates to a multi-face synchronous bonding device for paving tiles. The multi-face synchronous bonding device for paving the tiles comprises a frame, a linkage mechanism, a first tile-clamping slot and two second tile-clamping slots, wherein the first tile-clamping slot is located at the middle position of the frame, and the two second tile-clamping slots are symmetrically formed and connected to the first tile-clamping slot directly or indirectly. The structures of the first tile-clamping slot and the second tile-clamping slots are the same, clamping plates are arranged in thefirst tile-clamping slot and the second tile-clamping slots, the clamping plate in the first tile-clamping slot is connected with the clamping plates in the second tile-clamping slots through the linkage mechanism, and the three clamping plates can move synchronously by the linkage mechanism. The multi-face synchronous bonding device for paving the tiles is simple and ingenious in structure and convenient to use, and the bonding of the tiles can be effectively completed.

Description

technical field [0001] The patent of the present invention relates to the field of robots, in particular to a multi-surface synchronous bonding device for tile laying. Background technique [0002] With the development of society, people's living standards are getting higher and higher, and aesthetic concepts are also changing. In the current house decoration, people's requirements for decoration are getting higher and higher. Pasting ceramic tiles on the wall is especially common in the house decoration process. When there are exposed water pipes on the wall, the exposed water pipes should be surrounded by tiles and pasted. At present, the commonly used method of pasting is to tape the corners of the three tiles in advance. Position it, then use it to surround the water pipe, and then fill the gap between the tiles, water pipes and the wall with the mixture of cement and yellow sand from top to bottom. The non-fixed state is prone to shifting, and it is difficult to clean ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04F21/18
CPCE04F21/1838
Inventor 徐亦心
Owner 永春县产品质量检验所福建省香产品质量检验中心国家燃香类产品质量监督检验中心福建
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