Film for flexible flat cable reinforcement board
A flat cable and reinforcing plate technology, applied in the direction of flat/ribbon cable, insulated cable, cable, etc., can solve the problem of undocumented polyimide film, etc., to inhibit or prevent warping, inhibit or prevent wiring from falling off, Reduce the effect of air bubbles
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Embodiment 1
[0178] [Polyimide film laminate]
[0179] Toray DuPont Co., Ltd. "Kapton" 200H (50 μm thick, heat shrinkage rate 0.03 (%) after heating at 200° C. for 60 minutes) and 500H (125 μm thick, at 200° C. The thermal shrinkage rate after heating at °C for 60 minutes was 0.03 (%). As an adhesive, "Pyralux" LF0100 (25 µm thick) manufactured by DuPont was used. Next, the adhesive was sandwiched between 200H and 500H, and pressed under conditions of a heating temperature of 180° C., a pressure of 2 MPa, and a time of 60 minutes to obtain a polyimide film laminate (reinforcing plate). The polyimide film laminate had a thickness of 200 μm and a ring stiffness value of 2380 mN / cm.
[0180] [Flexible Flat Cable]
[0181] 10 parts by weight of EPICLON HP-7200 (manufactured by DIC Corporation, epoxy resin containing dicyclopentadiene skeleton), 100 parts by weight of Tuftec M1913 (manufactured by Asahi Kasei Chemical Co., Ltd., maleic acid-modified styrene-ethylene block copolymer) , Curezo...
Embodiment 2
[0191] Except for the Toray DuPont "kapton" 200H (50 μm thick, heat shrinkage rate after heating at 200°C for 60 minutes: 0.03 (%)) and 400H (100 μm thickness, heat shrinkage rate after heating at 200°C for 60 minutes: 0.03 (%) %))), a polyimide film laminate was obtained by the same procedure as in Example 1. The polyimide film laminate had a thickness of 175 μm and a ring stiffness of 1630 mN / cm.
[0192] Various evaluations were performed in the same manner as in Example 1 using this polyimide film laminate. There was also no deformation of the stiffener in the high-temperature test, and the conductors of the flexible flat cable were in firm contact with the conductors of the test wiring board. In the bending test, the conductors of the flexible flat cable and the conductors of the test wiring board are firmly in contact even when an external force is applied.
Embodiment 3
[0194] Except for the Toray DuPont "kapton" 300H (75 μm thick, thermal shrinkage rate after heating at 200°C for 60 minutes: 0.03 (%)) and 500H (125 μm thick, thermal shrinkage rate after heating at 200°C for 60 minutes: 0.03 (%) %))), a polyimide film laminate was obtained by the same procedure as in Example 1. The polyimide film laminate had a thickness of 225 μm and a ring stiffness of 3550 mN / cm.
[0195] Various evaluations were performed in the same manner as in Example 1 using this polyimide film laminate. There was also no deformation of the stiffener in the high-temperature test, and the conductors of the flexible flat cable were in firm contact with the conductors of the test wiring board. In the bending test, the conductors of the flexible flat cable and the conductors of the test wiring board are firmly in contact even when an external force is applied.
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Abstract
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