A power module packaging structure
A technology for power and packaging modules, applied in the field of power module packaging structure, can solve the problems of increasing the weight and manufacturing cost of intelligent power modules, and achieve the effects of improving stability and service life, improving sealing and consistency, and improving mechanical strength
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[0020] The preparation method of the plastic composite board 1 specifically includes the following steps:
[0021] (1) Preparation of the first base layer: the first base layer is formed by an injection molding process, and a plurality of first through holes arranged in a matrix are opened in the first base layer, and the diameter of the first through holes is 2-4 mm, the distance between the centers of adjacent first through holes is 4-8 mm, wherein the first composite material forming the first matrix layer is composed of the following components in parts by weight: PEN 50-70 parts ; 20-50 parts of polypropylene; 10-40 parts of EVA; 5-9 parts of melamine cyanurate; 1-1.5 parts of 2-hydroxy-4-methoxybenzophenone; 0.5-azobisisoheptonitrile 1 part; bis-2,2,6,6-tetramethylpiperidinol sebacate 0.3-0.6 part; β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid 0.5-2 parts of octacarbon alcohol ester; 1-3 parts of vinyl ethoxysilane; 2-4 parts of tert-butyl peroxide-3,5,5-trimethylhe...
Embodiment 1
[0027] A power package module, such as figure 1 As shown, the power packaging module includes a plastic composite board 1, an insulating layer 2 provided on the upper surface of the plastic composite board 1, a circuit wiring layer 3, and the circuit wiring layer 3 is provided on the insulating layer 2, A plurality of electronic components 4, the plurality of electronic components 4 are arranged on the circuit wiring layer 3, and the resin sealing layer 5 completely wraps the insulating layer 2, the circuit wiring layer 3, and the electronic components 4 As well as the upper surface and side surfaces of the plastic composite board 1, the lower surface of the plastic composite board 1 is exposed, and the electronic components 4 include power components and control components.
[0028] Such as figure 2 As shown, the plastic composite board 1 includes a first base layer 11, a first EVA modified layer 12, a second base layer 13, and a first weather-resistant resin layer 14 sequentia...
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