High-temperature bending test deflection measuring device and measuring method

Abstract

The invention discloses a high-temperature bending test deflection measuring device and a measuring method. An environment box is internally provided with a three-point or four-point bending fixture,and the deflection of a tested sample is transmitted to a displacement sensor outside the environmental box by a measuring extension rod and a Z-shaped frame. The bending fixture includes a first pressure bar assembly and a second pressure bar assembly movable relative to the first pressure bar assembly, the axes of the first pressure bar assembly and the second pressure bar assembly are coincident; the end of the first pressure bar assembly is provided with a first pressure roller and a second pressure roller for supporting test ends of the sample; the second pressure bar assembly is providedwith an upper pressure roller for applying pressure to the sample. The high-temperature bending test deflection measuring device is free from dependence on an optical measuring system, and avoids direct contact with a high temperature component when the displacement sensor is used, thereby effectively ensuring the accuracy and reliability of the high temperature bending test deflection measurement.

Description

technical field [0001] The invention discloses a test system suitable for realizing a material bending test and measuring deflection under a high temperature condition not exceeding 1000°C, and belongs to the technical field of material performance testing. Background technique [0002] Bending test is an important means of testing the mechanical properties of materials. The deflection is one of the core measurement parameters of the bending test. In the normal temperature bending test, the displacement sensing device is usually directly contacted with the sample to measure the bending deflection of the sample. However, in the research and development of aerospace-related materials, the bending test of some materials needs to be carried out in a high-temperature (room temperature to 1000°C) environment. At this time, the displacement sensor cannot be close to the high-temperature sample and cannot effectively measure the bending deflection of the sample. At present, the non-...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a non-optical deflection test device suitable for high temperature (room temperature

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