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Heat dissipation structure of electronic product

A technology of heat dissipation structure and electronic products, which is applied in the fields of electrical equipment structural parts, electrical components, electrical digital data processing, etc.

Inactive Publication Date: 2018-08-03
成都亿方游网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used heat dissipation methods generally adopt air cooling or water cooling, but if only air cooling or water cooling is used, the heat dissipation effect is limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A heat dissipation structure for electronic products, comprising a heat dissipation pipe, the heat dissipation pipe includes an inner pipe and an outer pipe sleeved outside the inner pipe, the gap between the two ends of the inner pipe and the outer pipe is closed, and the The cavity formed by the inner tube and the outer tube is filled with liquid, the inner wall of the inner tube is provided with a liquid adsorption layer, and one end of the heat dissipation tube is provided with an exhaust gas and water vapor into the inner tube.

Embodiment 2

[0018] This embodiment is optimized on the basis of the above embodiments, that is, both the outer tube and the inner tube are U-shaped.

[0019] The inner tube and the outer tube are arranged coaxially.

[0020] The liquid is water.

[0021] The diameter of the inner tube is half the diameter of the outer tube.

[0022] The liquid absorption layer is a grid cloth layer.

[0023] An outer tube is arranged outside the inner tube, and the gap between the two ends of the inner tube and the outer tube is closed to form a cavity formed between the inner tube and the outer tube. The outer tube is in direct contact with the heating element of the electronic product, and due to the heat conduction effect of the outer tube and the liquid, it can play a cooling effect. A liquid adsorption layer is set on the inner wall, and the exhaust gas accelerates the volatilization of the liquid on the liquid adsorption layer during the exhaust process, and accelerates the heat dissipation rate ...

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PUM

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Abstract

The invention discloses a heat dissipation structure of an electronic product. The heat dissipation structure of the electronic product comprises a heat dissipation pipe. The heat dissipation pipe comprises an inner pipe and an outer pipe which sleeves the inner pipe. A gap between two ends of the inner pipe and the outer pipe is closed. A cavity formed by the inner pipe and an outer pipe is filled with liquid. A liquid adsorption layer is arranged on the inner wall of the inner pipe. An exhaust object which exhausts air and water vapor to the inner pipe is arranged on one end of the heat dissipation pipe. The heat dissipation effect is great.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to a heat dissipation structure of electronic products. Background technique [0002] With the increasing performance of electronic products such as notebooks and tablet computers, the frequency of the internal central processing unit and graphics processing unit is getting higher and higher, which will cause the internal components to generate more and more heat. The requirements for heat conduction and heat dissipation are also getting higher and higher. [0003] At present, the commonly used heat dissipation methods generally adopt air-cooling or water-cooling methods, but if only air-cooling or water-cooling methods are used, the heat dissipation effect is limited. Contents of the invention [0004] In order to solve the above technical problems, the present invention provides a heat dissipation structure for electronic products. [0005] The present invention realizes thr...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/20336G06F1/203H05K7/20136
Inventor 罗涵
Owner 成都亿方游网络科技有限公司