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Top-ported microphone package with enlarged rear volume

A microphone and volume technology, used in microphone structure associations, loudspeakers, sensor components, etc., to solve problems such as size and thermo-mechanical motion and expansion tolerances, loss of internal volume of microphones, etc.

Active Publication Date: 2020-05-29
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Rerouting of electrical and acoustic signals is unnecessary, but MEMS chips, which are very stress sensitive, are secured between the components of the package and suffer from tolerances in terms of size and thermomechanical movement and expansion
As another disadvantage, the MEMS internal volume is allocated to the front volume and thus the internal volume is lost for the microphone

Method used

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  • Top-ported microphone package with enlarged rear volume
  • Top-ported microphone package with enlarged rear volume
  • Top-ported microphone package with enlarged rear volume

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Figure 1a and 1b Different cross-sections of top port microphones known from the prior art are shown. A MEMS chip MC and another chip as an ASIC IC are mounted on a PCB functioning as a substrate SU. Pads for electrically contacting the microphone are arranged at the bottom surface of the substrate. The two chip components are surrounded with adhesive under the lid LD glued and sealed to the substrate SU. The MEMS chip MC and the ASIC IC are sealed to the substrate with a lamination foil FL. The recess in the MEMS chip MC above its membrane MM is covered and thus protected by the first foil F1 arranged below the lamination foil LF. This recess forms the back volume VB of the microphone. The front volume is formed by the remaining volume enclosed under the lid LD. The sound port SPT in the lid LD puts the front volume VF in communication with the outside atmosphere. The openings in the laminate foil FL provide the membrane MM of the microphone with access to the s...

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PUM

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Abstract

A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.

Description

technical field [0001] The present application relates generally to a microphone package, and in particular to a top-ported microphone package with an enlarged rear volume. Background technique [0002] A bottom port microphone includes a package with an acoustic portion on the bottom side of the package carrying electrical contacts. The bottom side is formed by a carrier substrate onto which the top surface components of the microphone, like for example MEMS chips and ASICs, are mounted. The substrate typically includes a PCB or another multilayer substrate including internal wiring. [0003] The top port microphone has a sound port on the top surface facing away from the bottom side carrying the electrical contacts. It is then possible to arrange a MEMS chip near the sound port to provide a sufficiently large back volume. But the electrical rerouting must connect the chip terminals to the contact pads at the bottom of the package. This requires technical effort and rep...

Claims

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Application Information

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IPC IPC(8): H04R19/04
CPCH04R1/28H04R19/005H04R19/04H04R2201/003H04R1/04H04R1/083
Inventor M.金内鲁普P.H.O.龙巴赫J.T.拉文基尔德D.莫滕森K.拉斯姆森
Owner TDK CORPARATION
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