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System and method for measurement of complex structures

A complex and complex technology, applied in the general control system, measurement device, scattering characteristic measurement, etc.

Active Publication Date: 2018-08-17
VERITY INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In-situ measurements do not directly measure beams incident on or reflected from the wafer

Method used

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  • System and method for measurement of complex structures
  • System and method for measurement of complex structures
  • System and method for measurement of complex structures

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Embodiment Construction

[0023] In the following description, reference is made to the accompanying drawings which form a part hereof and in which are shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is understood that other embodiments may be utilized. It is also to be understood that structural, procedural and system changes may be made without departing from the spirit and scope of the present invention. Accordingly, the following description should not be viewed in a limiting sense. For clarity of presentation, like features shown in the drawings are designated with like reference numerals, and like features shown in alternative embodiments in the drawings are designated with like reference numerals. Other features of the invention will be apparent from the drawings and from the following detailed description. It should be noted that ...

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Abstract

A system and method of use for simplifying the measurement of various properties of complex semiconductor structures is provided. The system and method supports reduction of structure complexity and modeling for optical monitoring and permits determination of film thicknesses and feature depths during semiconductor manufacturing processes.

Description

[0001] Related Application Cross Reference [0002] This application claims the serial number of the application entitled "SYSTEM AND METHOD FORMEASUREMENT OF COMPLEX STRUCTURES" filed on February 8, 2017 by Andrew Weeks Kueny to the benefit of US Provisional Application 62 / 456,348, commonly assigned with this application and incorporated herein by reference. technical field [0003] The present invention relates to optical measurement systems, and more particularly, to an optical measurement system and method for more reliably measuring properties of complex semiconductor structures. The systems and methods, as well as computer program products, can be used to monitor film thickness, feature depth, and other properties of semiconductor structures during semiconductor processing. Background technique [0004] Optical metrology systems are employed in various industries, such as the semiconductor processing industry, for real-time monitoring of wafer modification and proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06G01B11/22G01N21/55
CPCG01B11/06G01B11/22G01N21/55G01B2210/56H01L22/12G01B11/0683G01B11/0625H01L22/20H01L22/10H01L22/30H01L21/67242G05B19/41885G05B23/02G05B2219/2602G01N21/8422G06K7/0095
Inventor A·W·科伊尼
Owner VERITY INSTR