Method for Predicting Yield Rate of Circuit Board
A forecasting method and circuit board technology, applied in forecasting, printed circuit, printed circuit manufacturing, etc., can solve the problem that the yield rate cannot be effectively estimated, achieve reasonable and effective production arrangements, and improve production efficiency.
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[0092] Example: The circuit board processing requirements given by the customer are shown in Table 1. The customer also requires special processing of gold finger technology and partial mixed pressure. The special process yield of each special process is shown in Table 2. The corresponding process yield of each process is good The rates are shown in Table 3 and Table 4.
[0093] Based on the customer's given requirements and comparing Table 3 and Table 4, the main process of circuit board processing is determined as follows: inner layer dry film → inner layer etching → inner layer AOI → lamination → drilling → copper sinking → plate plating → outer surface Layer dry film→graphic plating→outer layer etching→solder mask→characters→spray tin→milling (shape), therefore, the benchmark yield is:
[0094] R 0 =A 1 *A 2 *A 3 *A 4 *A 7 *A 12 *A 10 *A 16 *A 19 *A 20 *A 21 *A 23
[0095] Table 1 Default Capability Items
[0096] customer request Default ability...
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