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Flexible substrate, preparation method of the same, and display apparatus

A flexible substrate and flexible substrate technology, applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve the problems of inorganic film layer fracture, inorganic film layer prone to cracks, and affecting the display function of flexible substrates, etc., to achieve The effect of prolonging the service life and enhancing the reliability

Active Publication Date: 2018-08-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since there are a large number of inorganic films in the flexible substrate (the total thickness of the inorganic films is more than 1000nm), when the flexible substrate is bent, it is affected by the stress on the front and back sides, and the inorganic film is prone to cracks.
In the follow-up environment, due to stress release or external force (such as external pressure during transportation), the cracks in the inorganic film will continue to expand, which may cause the inorganic film to break, which in turn leads to Structures such as signal lines or OLED devices on flexible substrates are vulnerable to water and oxygen corrosion, which affects the display function of flexible substrates

Method used

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  • Flexible substrate, preparation method of the same, and display apparatus
  • Flexible substrate, preparation method of the same, and display apparatus
  • Flexible substrate, preparation method of the same, and display apparatus

Examples

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Embodiment 1

[0037] like figure 1 As shown, this embodiment provides a flexible substrate, which may be a flexible OLED display substrate. The flexible substrate includes: a flexible substrate 1; a functional device on the flexible substrate 1; a protective layer 4 located on the side of the functional device away from the flexible substrate 1, the protective layer 4 has cracks caused by bending, and is used for A filling structure that will fill the cracks.

[0038] When the flexible substrate is bent, due to stress, the protective layer 4 at the bent position is prone to cracks. Moreover, in the subsequent process, due to stress release or external force (for example, external pressure during transportation), the cracks in the protective layer 4 will continue to expand, which may cause the protective layer 4 to break. However, in this embodiment, when the flexible substrate is bent, a filling structure is formed on the flexible substrate, and the filling structure is used to fill the c...

Embodiment 2

[0044] like Figure 2 to Figure 6 As shown, this embodiment provides a method for preparing a flexible substrate, which can be used to prepare the flexible substrate provided in Embodiment 1.

[0045] Among them, the flexible substrate includes: a flexible substrate 1; a functional device on the flexible substrate 1, a protective layer 4 located on the side of the functional device away from the flexible substrate 1, and used to fill cracks in the protective layer 4 due to bending filling structure. Among them, the functional devices may include OLED devices, thin film transistors, and signal lines 2, etc.; the protective layer 4 may include structures such as encapsulation layer and top film 43.

[0046] The following takes the functional device as the signal line 2 as an example to describe this embodiment in detail.

[0047] The preparation method includes:

[0048] S1 , forming a signal line 2 on a flexible substrate 1 .

[0049] like figure 2 As shown, the conductiv...

Embodiment 3

[0076] This embodiment provides a display device, including the flexible substrate provided in Embodiment 1.

[0077] Wherein, the display device may be an OLED display device, such as electronic paper, OLED panel, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator and any other product or component with display function.

[0078] In the display device in this embodiment, the filling structure is used to fill the cracks caused by bending in the protective layer, and the cracks are repaired to reduce the probability of the cracks expanding due to stress release. At the same time, the filling structure can effectively reduce the water , Oxygen and other corrosion to functional devices, thereby prolonging the service life of functional devices and enhancing the reliability of functional devices.

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PUM

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Abstract

The invention provides a flexible substrate, a preparation method of the same, and a display apparatus, and belongs to the technical field of display. The flexible substrate, the preparation method ofthe same, and the display apparatus can solve the problem that part of the film layer in a current flexible substrate is cracked because of folding and then the cracks are further enlarged, so that the structural performance of a signal line or an OLED device is influenced. The flexible substrate includes a flexible substrate, a functional device on the flexible substrate, a protection layer which is arranged at one side, partitioned from the flexible substrate, of the function device, and a filling structure for filling the cracks, wherein the cracks caused by folding are formed in the protection layer.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a flexible substrate, a preparation method thereof, and a display device. Background technique [0002] In the existing OLED flexible display device, in order to reduce the frame width, the flexible substrate is bent, so that the bonding area is placed on the side of the flexible substrate facing away from the display area. Since the flexible substrate is provided with a large number of inorganic film layers (the total thickness of the inorganic film layer is above 1000nm), when the flexible substrate is bent, it is affected by the stress on both sides, and the inorganic film layer is prone to cracks. In the follow-up environment, due to stress release or external force (such as external pressure during transportation), the cracks in the inorganic film will continue to expand, which may cause the inorganic film to break, which in turn leads to Structures such as sig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/00H10K77/111H10K50/84H10K71/00Y02E10/549
Inventor 田宏伟牛亚男刘政赵梦左岳平马伟欣
Owner BOE TECH GRP CO LTD