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Die device and method for using same

A mold, mold side technology, applied in the field of mold devices, can solve the problems of deterioration of dimensional accuracy and shape accuracy, uneven wear, burrs on products, etc., and achieve the effect of suppressing misalignment

Active Publication Date: 2018-08-21
MITSUI HIGH TEC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are problems in that uneven wear occurs in sharpened objects (punch 84 and die 86), burrs are generated in products, and dimensional accuracy and shape accuracy deteriorate

Method used

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  • Die device and method for using same
  • Die device and method for using same
  • Die device and method for using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0091] figure 1 (A) is a schematic view illustrating a state in which a guide post having an outer diameter such that the balls 35 of the ball retainer 33 are largely moved outward in the radial direction thereof is inserted into the ball cage 33 in a vertical state .

[0092] figure 1(A) Figure shows that the guide post 34 is inserted into the guide sleeve 37 through the ball retainer 33 along the axial direction of the guide sleeve 37 (see figure 2 (A) and 2(B)). In this case, the balls 35 of the ball cage 33 move (squeezed) radially outward of the ball cage 33 (guide pin 34 ) along the outer diameter of the guide pin 34 while rotating in contact with the guide pin 34 . out). Pressing force is applied to the inner surface of the guide sleeve 37 through the balls 35 moving outward in the radial direction. The retaining force from the guide sleeve 37 is applied to the guide post 34 due to the reaction force of the pressing force. As a result, the guide post 34 can smo...

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PUM

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Abstract

The die device 10 has a stripper holder 19 that is supported by multiple guide posts 15, which connect between an upper die 12 attached to a press slide plate 11 and a lower die 14 attached to a pressbolster 13, and moves up and down in conjunction with the upper die 12, thereby guiding a punch 16 of the upper die 12 into a die hole 18 of a die 17 disposed on the lower die 14. The guide post 15 has an upper guide post 29 that is fitted in an upper guide bush 27 of the upper die 12 via an upper ball retainer 28, thereby connecting the stripper holder 19 with the upper die 12. The upper guide post 29 is formed in a stepped shape wherein a post lower part 32 located on the stripper holder 19 side has a smaller diameter than a post upper part 31 located on the upper die 12 side.

Description

technical field [0001] The invention relates to a mold device and a method for using the mold device. Background technique [0002] Such as Figure 8 As shown, in the die set 80 , a workpiece 81 to be punched is pressed against a lower die 82 using a stripper plate 85 , and then an upper die 83 is moved downward so that it is punched by a punch 84 provided in the upper die 83 The blanked workpiece 81 . The stripper plate holder 88 holds the stripper plate 85 and guides the punch 84 to the die hole 87 of the die 86 provided in the lower die 82 . The stripper plate holder 88 is provided to freely move back and forth with respect to the lower mold 82 . As a result, products requiring high dimensional accuracy and shape accuracy are punched out. [0003] Upper die 83 includes: punch plate 89, which holds punch 84; punch back plate 90, which supports punch plate 89; and punch holder (upper die base) 91, This punch holder 91 attaches the punch back plate 90 to a punch slide pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D37/10B21D28/04B21D28/34B30B15/04
CPCB21D28/04B21D28/34B21D37/10B30B15/04
Inventor 宗冈秀策鹈木一茂日向寺伦纪
Owner MITSUI HIGH TEC INC
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