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A method of controlling expansion and contraction of substrate

A technology for controlling substrates and substrates, applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of increasing material costs, increasing precision equipment costs, and fixture costs, and achieve good expansion and contraction effects

Inactive Publication Date: 2020-10-09
江西芯创光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing technologies use base materials with a small thermal expansion coefficient (CTE value) as processing materials, or use equipment or fixtures to compensate for expansion and contraction in the post-process, but the disadvantage is that it will greatly increase the cost of materials and greatly increase the cost of precision equipment. Input costs and fixture costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Take Mitsubishi's gas BT base material as an example, the base material is composed of epoxy resin and glass fiber. Through the test, it can be concluded that: under the condition of high temperature and high humidity, the board expands the largest and the speed is the fastest; under the condition of high temperature and low humidity, the board shrinks inward, but it will stop to a certain extent; Small; under low temperature and low humidity conditions, the board basically does not fluctuate much, and it can be considered to maintain its original shape. Among them, high temperature refers to higher than 120 degrees Celsius, low temperature refers to lower than 30 degrees Celsius, high humidity refers to higher than 70% humidity, and low humidity refers to lower than 30% humidity. The first temperature refers to the temperature above low temperature, the first humidity is greater than or equal to the humidity of high humidity, the drying temperature refers to the temper...

Embodiment 2

[0021] Taking the substrate of Guangdong Shengyi Technology Co., Ltd. as an example, the substrate is composed of epoxy resin and glass fiber. Through the test, it can be concluded that: under the condition of high temperature and high humidity, the board expands the largest and the speed is the fastest; under the condition of high temperature and low humidity, the board shrinks inward, but it will stop to a certain extent; Small; under low temperature and low humidity conditions, the board basically does not fluctuate much, and it can be considered to maintain its original shape. Among them, high temperature means higher than 110 degrees Celsius, low temperature means lower than 31 degrees Celsius, high humidity means higher than 75% humidity, and low humidity means lower than 35% humidity. The first temperature refers to the temperature above low temperature, the first humidity is greater than or equal to the humidity of high humidity, the drying temperature refers to the te...

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PUM

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Abstract

The invention discloses a method for controlling the expansion and contraction of a substrate so that the expansion and contraction can be controlled well without the need to increase the material cost or investing more devices or tools additionally. The method comprises: S1, acquiring expansion and contraction rules of a substrate under different humidity and different temperature conditions andacquiring a first temperature, a first humidity value, a drying temperature, a second humidity value and a second temperature based on the expansion and contraction rules; S2, enabling the substrate to reach the first humidity value at the first temperature during substrate cleaning; and S3, carrying out drying after cleaning, changing the humidity of the substrate at the drying temperature, enabling the substrate to reaches the second humidity value, taking out the processed substrate after drying, and reducing the temperature of the substrate to reach the second temperature to obtain a needed substrate.

Description

technical field [0001] The invention relates to a method for controlling expansion and contraction of a substrate. Background technique [0002] In the manufacturing of printed circuit boards and flexible printed circuit boards, there will be problems of expansion and contraction of the substrate during processing. Points can meet the requirements of the design position, so as to provide the basis for accurate connection of components or the second substrate for the post-process. Therefore, the control of substrate expansion and contraction is very important for the control of product yield, and it also restricts production efficiency and cost. [0003] Most of the existing technologies use base materials with a small thermal expansion coefficient (CTE value) as processing materials, or use equipment or fixtures to compensate for expansion and contraction in the post-process, but the disadvantage is that it will greatly increase the cost of materials and greatly increase the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0011H05K3/0085H05K2203/1105H05K2203/111
Inventor 袁晋
Owner 江西芯创光电有限公司