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A kind of etching device control method and system

A technology of an etching device and a control method, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve problems such as reverse deposition of chemical reactants, and achieve the effect of avoiding residues of reactants and improving quality

Active Publication Date: 2019-03-01
福建省福联集成电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] For this reason, it is necessary to provide an etching device control method and system to solve the problem of reverse deposition of chemical reactants produced by the existing etching device when the wafer leaves the reaction tank

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  • A kind of etching device control method and system
  • A kind of etching device control method and system
  • A kind of etching device control method and system

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Embodiment Construction

[0037] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0038] see Figure 1 to Figure 6 , this embodiment provides an etching device control method and system, the existing etching device such as figure 1 As shown, it includes a reaction tank and an overflow tank. There is also a circulation pipeline for pumping the solution from the overflow tank to the bottom of the reaction tank. The robot arm is used to put the wafer into the reaction tank for chemical reaction and After the reaction, the wafer is taken out from the reaction tank. The etching device 1 of the present embodiment is as figure 2 As shown, it includes a reaction tank 2, a first pipeline 3, a second pipeline 4, a circulation cleaning unit 5 and a spray unit 6. The circulation cleaning unit communicates with the bottom of...

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Abstract

The invention discloses an etching device control method and system. The etching device control method is applied to an etching device and comprises the following steps of: controlling a circulating cleaning unit to pump a solution from an overflow tank to an incident unit at the bottom of a reaction tank; controlling a mechanical arm to move a boat into the reaction tank; within a preset time before the end of the process, controlling the circulating cleaning unit to pump the solution from the bottom of the reaction tank to a shower unit; and at the end of the process, controlling the mechanical arm to move the boat from the reaction tank. The above technical solution extracts the solution in the reaction tank through the circulating cleaning unit, and washes the reacted wafer after cleaning and filtering, thereby avoiding residual reactants on the wafer, and improving the quality of chemical etching.

Description

technical field [0001] The present invention relates to the technical field of wafer etching devices, in particular to an etching device control method and system. Background technique [0002] A wafer etching device is a device that uses a solution to etch a wafer. After the existing wafer etching is completed, the wafer is generally lifted out of the etching solution in the reaction tank directly by a hanger. In this way, when the wafer leaves the reaction tank, the etching solution will adhere to the wafer wall. Since the etching solution contains chemical reactants, the chemical reactants will adhere to the wafer, resulting in the deposition of chemical reactants. Contents of the invention [0003] Therefore, it is necessary to provide an etching device control method and system to solve the problem of reverse deposition of chemical reactants produced by the existing etching device when the wafer leaves the reaction tank. [0004] In order to achieve the above object,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67075
Inventor 许孟凯王嘉伟黄建顺陈胜男林张鸿林豪林伟铭
Owner 福建省福联集成电路有限公司