Composite high temperature resistant fiberboard bathroom cabinet and preparation method thereof
A technology of high temperature resistant fibers and composite fibers, which is applied in chemical instruments and methods, manufacturing tools, sanitary equipment, etc., can solve the problems of large differences in thermal expansion and contraction coefficients between fireproof boards and fiberboards, prone to cracks, and high prices. Achieve the effect of improving the overall quality and service life, avoiding cabinet deformation, and excellent waterproofing
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Embodiment 1
[0017] The composition of the silicon-oxygen adhesive composition of the present embodiment is as follows:
[0018] Alcohol modified sepiolite: 6.0wt%;
[0019] Colloidal silicon dioxide: 15.0wt%;
[0020] Liquefied MDI: 5.0wt%;
[0021] Succinimide: 1.8wt%;
[0022] Mixed solvent: balance.
[0023] Dip the above-mentioned silicon-oxygen adhesive composition in 2 wooden surfaces, the coating amount of silicon-oxygen adhesive composition is 100mg / cm 2 , under normal temperature conditions, it is docked with the fiber core board and applied a pressure of 0.5MPa to keep for 1 hour, and then placed at room temperature for 24 hours to obtain a composite fiber board (the surface does not form a fluororesin protective surface layer).
Embodiment 2
[0025] The composition of the silicon-oxygen adhesive composition of the present embodiment is as follows:
[0026] Alcohol modified sepiolite: 11.2wt%;
[0027] Colloidal silicon dioxide: 18.0wt%;
[0028] Liquefied MDI: 6.0wt%;
[0029] Maleimide: 2.1wt%;
[0030] Mixed solvent: balance.
[0031] Dip the above-mentioned silicon-oxygen adhesive composition in 2 wooden surfaces, the coating amount of silicon-oxygen adhesive composition is 100mg / cm 2 , under normal temperature conditions, it is docked with the fiber core board and applied a pressure of 0.5MPa to keep for 1 hour, and then placed at room temperature for 24 hours to obtain a composite fiber board (the surface does not form a fluororesin protective surface layer).
Embodiment 3
[0033] The composition of the silicon-oxygen adhesive composition of the present embodiment is as follows:
[0034] Alcohol modified sepiolite: 10.0wt%;
[0035] Colloidal silicon dioxide: 18.0wt%;
[0036] Liquefied MDI: 5.1wt%;
[0037] Phthalimide: 2.2wt%;
[0038] Mixed solvent: balance.
[0039] Dip the above-mentioned silicon-oxygen adhesive composition in 2 wooden surfaces, under the normal temperature condition, it is docked with the fiber core board and applied the pressure of 0.5MPa to keep for 1 hour, then placed at normal temperature for 24 hours to obtain the composite fiberboard (the surface does not form Fluorine resin protective surface).
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