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A kind of high reliability and high fluidity car-like epoxy resin composition and its application

A kind of epoxy resin, high fluidity technology, applied in the field of automotive electronic packaging, can solve the problems of long-term reliability of devices, instability of failure mode, drift of electrical parameters, etc., to improve product reliability and strong ion capture ability , The effect of stable electrical performance

Active Publication Date: 2020-06-30
ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to changes in physical properties of the substances dissociated during the corrosion process, such as increased brittleness, increased contact resistance, and changes in thermal expansion coefficients, electrical parameters will drift with changes in temperature and loading voltage during device use or storage. , Excessive leakage current, even failure modes such as short circuit or open circuit, and some failure modes are unstable, and some device functions may be restored under certain conditions, but as long as corrosion occurs, it will bury hidden dangers to the long-term reliability of the device

Method used

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  • A kind of high reliability and high fluidity car-like epoxy resin composition and its application
  • A kind of high reliability and high fluidity car-like epoxy resin composition and its application
  • A kind of high reliability and high fluidity car-like epoxy resin composition and its application

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Experimental program
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specific Embodiment approach 1

[0020] Embodiment 1: This embodiment provides a kind of epoxy resin composition with high reliability and high fluidity for automobiles, specifically by mass parts, it consists of 2-15 parts of epoxy resin, 2-10 parts of hardener, 0.1-6 parts of flame retardant, 0.01-1 part of hardening accelerator, 70-95 parts of inorganic filler and 0.1-0.8 parts of coupling agent; wherein, the coupling agent is 2-methyl- 5-amino-2H-tetrazolium, 2-ethyl-2H-tetrazolium-5-amine, 1-ethyl-1H-tetrazolium-5-amine, 5-aminotetrazolium, 2-propan-2 One or more of -alkenyltetrazolium-5-amine and 3-[2-hydrocarbyl-3-(2H-tetrazole-5-amino)-propoxy]-propyltrimethoxysilane The mixture of ratios; the ion capture agent is one of AD-100, AD-300, AD-770D, AD700P and AD020-4C or a mixture of several of them in any ratio; the AD-100, AD-300 The structural formulas of , AD-770D, AD700P and AD020-4C are as follows:

[0021]

[0022] In this embodiment,

[0023] The structural formula of 2-methyl-5-amino-2H-te...

specific Embodiment approach 2

[0037] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the epoxy resin is bisphenol epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin Oxygen resin, biphenyl type epoxy resin, trisphenol methane type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, epoxy resin containing triazine core structure, novolac type novolac epoxy resin, phenolic type One of alkyl novolac epoxy resins, modified novolac epoxy resins and dicyclopentadiene epoxy resins or a mixture of several of them in any proportion; preferably novolac type alkyl novolac epoxy resins and biphenyl rings One or two mixtures of epoxy resins in any proportion.

[0038] In this embodiment, examples of commercially available epoxy resins include: CNE-200ELA (manufactured by Changchun Chemical); ESCN-195XL (manufactured by Sumitomo Chemical); YX-4000H (manufactured by Shell); N-670 (manufactured by DIC Japan) ;...

specific Embodiment approach 3

[0040] Specific embodiment three: the difference between this embodiment and specific embodiment two is that: the hardener is a phenolic resin; Base resin, naphthalene-type phenolic resin and cyclopentadiene-type phenolic resin or a mixture of several of them in any proportion; preferably one or two of cresol phenolic resin and naphthalene-type phenolic resin in any proportion mixture.

[0041] In this embodiment, examples of commercially available phenolic resins include: TD-2131 (manufactured by DIC in Japan), HRJ-1583 (manufactured by Schenectady), XLC-3L (manufactured by Mitsui Chemicals), HP-5000 (manufactured by DIC in Japan), PK-7500 (manufactured by KOLON Chemical), HP-7200 (manufactured by DIC Japan), KPH-F3065 (manufactured by KOLON).

[0042] In this embodiment, the hardener needs to be used with epoxy resin, which is well known to those skilled in the art, such as but not limited to phenolic resin; the phenolic resin in this embodiment contains two or more hydroxy...

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Abstract

The invention relates to an epoxy resin-like composition for a high-reliability and high-flowability vehicle as well as application of the epoxy resin-like composition. The epoxy resin-like composition for the high-reliability and high-flowability vehicle is prepared from the following components in parts by mass: 2 to 15 parts of epoxy resin, 2 to 10 parts of a hardening agent, 0.1 to 6 pats of aflame retardant, 0.01 to 1 part of a hardening accelerator, 70 to 95 parts of an inorganic filling material, 0.1 to 0.8 part of a coupling agent and 0.1 to 0.6 part of an ion catcher. In the epoxy resin-like composition for the high-reliability and high-flowability vehicle, the coupling agent is dispersed in a molding material uniformly, has high compatibility, has good adhesive force on nickel,has stable reflow soldering resistance and electrical property and can meet the automotive electronic-like encapsulation requirement when being applied to encapsulation of a nickel plating component;and the ion catcher is adopted, has relatively high ion catching capability and relatively heat resistance, can effectively reduce the contents of Na<+> and Cl<-> and can improve the reliability. Theepoxy resin-like composition for the high-reliability and high-flowability vehicle is suitable for encapsulation of nickel-planting like components for vehicles.

Description

technical field [0001] The invention relates to the field of electronic packaging for vehicles, in particular to a high-reliability and high-fluidity vehicle-like epoxy resin composition and its application. Background technique [0002] Epoxy molding compound has excellent mechanical, heat resistance, acid and alkali resistance and electrical properties after curing, which makes epoxy resin very important in composite materials such as sports equipment, automobiles and aerospace industries. Due to its easy curing, low curing shrinkage, and good adhesion, mechanical properties and chemical resistance, epoxy resin has been widely used in the 3C industry (computer, communication, consumer electronics) in recent years. IC packaging materials. The main purpose of IC packaging is to protect the chip, wires and circuits from moisture, dust and other external forces in the air, so as to improve the service life and reliability of the chip. The requirements for the reliability and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L91/06C08K13/04C08K7/18C08K3/22C08K5/544C08K3/34
CPCC08K2003/2227C08K2201/014C08L63/00C08L2201/02C08L2201/08C08L2203/206C08L2205/03C08L91/06C08K13/04C08K7/18C08K3/22C08K5/544C08K3/34
Inventor 李进王殿年杨磊磊邵志峰
Owner ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD