Real-time 3D full-focus phased array ultrasonic imaging method and device and storage medium

An ultrasonic imaging method and full-focus technology, applied in measuring devices, using sound waves/ultrasonic waves/infrasonic waves to analyze solids, using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc., to achieve reliable detection results, easy damage, and intuitive detection imaging results Effect

Inactive Publication Date: 2018-09-04
GUANGDONG GOWORLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Real-time 3D detection and display of the workpiece to be tested

Method used

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  • Real-time 3D full-focus phased array ultrasonic imaging method and device and storage medium
  • Real-time 3D full-focus phased array ultrasonic imaging method and device and storage medium
  • Real-time 3D full-focus phased array ultrasonic imaging method and device and storage medium

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Embodiment Construction

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0033] Reference figure 1 Schematic diagram shown.

[0034] The embodiment of the present invention is described with an 8*8 two-dimensional area array transducer. In this embodiment, 64 fully parallel phased array hardware channels are provided, and each channel can independently excite each element of the area array transducer And collect echo data. The system collects the 3D full matrix (3D-FMC, Three-Dimensional Full Matrix Capture) waveform signal in the inspected workpiece in real time through the area array transducer, and the Hilbert filter built in the FPGA chip filters the full matrix signal in real time. Eliminate the problem of signal discontinuity after focusing due to the periodic oscillation characteristics of the waveform. The processed full matr...

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Abstract

The embodiment of the invention discloses a real-time 3D full-focus phased array ultrasonic imaging method. The method comprises building a three-dimensional space rectangular coordinate system with the top surface of a workpiece to be tested, calculating launch time of ultrasonic wave, orderly transmitted by each array element of a two-dimensional area array transducer, transmitted from a coupledzone to a target defect point in a workpiece to be tested and reflection time of ultrasonic wave, reflected by the target defect point, transmitted from the workpiece to be tested to the coupled zoneand received by the two-dimensional area array transducer, building full-matrix data through the launch time and the reflection time and carrying out 3D full-focus reconstitution on the target defectpoint. The embodiment of the invention also discloses a device for real-time 3D full focus phased array ultrasonic imaging and a readable storage medium. The device collects the full-matrix waveformsignal of the three-dimensional space in the workpiece to be tested in real time, can carry out real-time 3D full-focus imaging detection, can produce visualized detection imaging results, has a fastdetection rate, produces a reliable detection result and realizes easy observation of damages.

Description

Technical field [0001] The invention relates to the field of ultrasonic detection, and in particular to a real-time 3D all-focus phased array ultrasonic detection imaging method, device and storage medium. Background technique [0002] At present, domestic and foreign researchers are still focusing on using the one-dimensional echo signal of the A-wave digital ultrasonic detector to describe the detection part, or use the traditional phased array imaging detector to perform the two-dimensional inspection on the detection part. In the stage of profile imaging detection, or the conventional probe is driven by a servo motor to collect the waveform of the workpiece by the water immersion method, after the collection is completed, a 3D image is synthesized offline. In fact, the inspection processes of these three schemes are relatively complicated. Although the traditional phased array two-dimensional imaging inspection technology can also detect the defects inside the inspection part...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/06G01N29/07G01N29/22
CPCG01N29/069G01N29/07G01N29/22G01N2291/011G01N2291/023G01N2291/0289
Inventor 杨贵德詹红庆杜南开陈振光崔金光杨青兰
Owner GUANGDONG GOWORLD
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