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Touch screen and touch layer

A technology of touch screen and touch layer, which is applied in the direction of instruments, electrical digital data processing, and input/output process of data processing, etc. It can solve the problems of difficult overlapping, misalignment, and inability to perform normal binding of binding pads, etc., to achieve The effect of improving product yield

Inactive Publication Date: 2018-09-04
TRULY OPTO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the inaccurate alignment between different functional layers in the yellow light process, there will be alignment tolerances between the bonding pads, and because the pins of the flexible circuit board are based on the bonding on each functional layer The standard position of the pad is set, and the existence of alignment tolerance makes it difficult to overlap between the pins of the flexible circuit board and the binding pad in the touch layer when the flexible circuit board is used to bind the touch layer, thus The phenomenon of misalignment or inability to perform normal binding occurs

Method used

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Embodiment Construction

[0022] Embodiments of the present invention provide a touch screen and its touch layer, which can avoid alignment tolerances during use, and when using a flexible circuit board to bind the touch layer, the pins of the flexible circuit board can be aligned with the touch control layer. The precise alignment of each binding structure on the layer improves the product yield.

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection s...

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PUM

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Abstract

The invention discloses a touch screen and a touch layer. The touch screen comprises N functional layers. One of the functional layers is provided with a first binding structure corresponding to eachof its own traces and a second binding structure corresponding to each of the other functional layers, where N is a positive integer not less than 2. One functional layer is not only provided with each first binding structure corresponding to each of its own traces, and provided a second binding structure corresponding to respective traces on other functional layers. Therefore, there is no alignment tolerance between each first binding structure and each second binding structure. The pin of the flexible circuit board only needs to be designed according to each binding structure on the functional layer. Therefore, when the flexible circuit board is used to bond the touch layer, the pin of the flexible circuit board and the binding structures on the touch layer can be accurately aligned to improve the product quality.

Description

technical field [0001] Embodiments of the present invention relate to the field of touch technology, in particular to a touch screen and a touch layer thereof. Background technique [0002] The touch layer of the display screen or touch screen is usually composed of multiple functional layers, and the bonding structures of different functional layers (abbreviated as bonding pads) are respectively formed with the corresponding wiring at one time (for details, please refer to figure 1 and figure 2 , figure 1 and figure 2 It is a schematic structural diagram of the upper and lower functional layers in the touch layer in the prior art), that is, each functional layer is provided with binding pads corresponding to the routing of the functional layer. However, due to the inaccurate alignment between different functional layers in the yellow light process, there will be alignment tolerances between the bonding pads, and because the pins of the flexible circuit board are based ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCG06F3/0412G06F2203/04103
Inventor 吴德生崔子龙林高
Owner TRULY OPTO ELECTRONICS
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