Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Middle frame manufacturing method, middle frame and electronic device

A manufacturing method and frame technology, applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, casings/cabinets/drawer components, etc., can solve problems such as increased production costs, and reduce production costs and Small processing cost, guarantee the effect of appearance requirements

Inactive Publication Date: 2018-09-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current manufacturing method of the middle frame adopts the CNC milling process, which leads to an increase in production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Middle frame manufacturing method, middle frame and electronic device
  • Middle frame manufacturing method, middle frame and electronic device
  • Middle frame manufacturing method, middle frame and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0029] In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by the term "thickness" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than implying Or an indication that the device or element referred to must have a particular orientation, be constructed and oper...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a middle frame manufacturing method, a middle frame and an electronic device. The method comprises the steps of: providing a plate piece and an edge piece, wherein the plate piece has a first surface to be processed, and the edge piece has an outer surface to be processed; performing pressure casting of the first surface to be processed of the plate piece to obtain amiddle frame, wherein the middle frame has a first forming portion; processing the edge piece to obtain a frame piece, wherein the outer surface to be processed is subjected to numerical control milling to form an appearance portion, and the frame piece further has a connection portion opposite to the appearance portion; splicing the connection portion and the edge of the middle plate to obtain the middle frame main body; and processing the middle frame main body to obtain a middle frame. The middle frame only need to perform numerical control milling of the outer surface of the middle frameto reduce the processing time, reduce the processing cost, ensure the appearance requirement of the middle frame and allow the manufacturing method of the middle frame to greatly reduce the manufacturing cost.

Description

technical field [0001] The present application relates to the field of electronic equipment, and in particular to a method for manufacturing a middle frame, a middle frame and an electronic device. Background technique [0002] The electronic device includes a middle frame, and the middle frame carries functional devices. The current manufacturing method of the middle frame adopts a numerical control milling process, which leads to an increase in production cost. Contents of the invention [0003] The present application provides a method for manufacturing a middle frame, a middle frame and an electronic device. [0004] The present application provides a method for making a middle frame, wherein the method for making a middle frame includes the steps of: [0005] providing a panel and an edge piece, the panel having a first surface to be machined, the edge piece having an outer surface to be machined; [0006] Die-casting the first surface to be processed of the plate ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02B23P15/00
CPCH05K5/0217B23P15/00
Inventor 王放
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com