Plastic sucking moulding process for damping insole
A blister molding and process technology, which is applied in the field of shoe midsole molding, can solve the problems of increased enterprise cost, inability to fine-tune realization, limited processing efficiency, etc., and achieve the effect of improving molding efficiency.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.
[0030] Such as figure 2 Shown, it is a kind of shock-absorbing midsole blister forming process that the present invention relates to, comprises the following steps:
[0031] ①Using TPU material with a Shore hardness of 55A-75A to process into a TPU film 21 with a thickness of 1.0mm-4.0mm;
[0032] ②The TPU film 21 is heated and softened, placed in a blister machine for blister molding, and then shaped to obtain a TPU container 22 with a bottom wall 221 and a side wall 222 after cooling, the TPU container 22 has an upper opening, and the bottom wall 221 and the side wall 222 form a cavity 223;
[0033] 3. Fill up the ETPU particles 23 in the cavity 223 of the TPU container 22;
[0034] ④ Use a layer of TPU film 24 with a thickness of 0.03mm-0.1mm to cover the upper opening 224 of the TPU container 22 and con...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Shore hardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com