Adhesive glue preparation device for electronic product

An electronic product and bonding technology, which is applied in the direction of mixer accessories, mixers, mixers with rotating stirring devices, etc., can solve the problems of time-consuming, laborious, uneven mixing, etc., and achieve the effect of easy use and lightening the burden

Pending Publication Date: 2018-09-25
泉州市君贤网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the shortcomings of time-consuming, labor-intensive and uneven mixing in the prior art, the technical problem to be solved by the present invention is to provide a time-saving, labor-saving and uniformly mixed glue preparation equipment for bonding electronic products

Method used

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  • Adhesive glue preparation device for electronic product
  • Adhesive glue preparation device for electronic product
  • Adhesive glue preparation device for electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of glue preparation equipment for bonding electronic products, such as Figure 1-5As shown, it includes a bottom plate 1, a pole 2, a mounting frame 3, a box body 4, a discharge pipe 5, a first valve 6, a feed hopper 8, a rack 10, a guide sleeve 11, a guide rod 13, a piston 14, Mounting plate 15, first slide rail 16, first slider 17, bearing housing 18, rotating shaft 19, blade 20, gear 21 and spring 22, base plate 1 top is left and right symmetrically provided with strut 2, and strut 2 top is connected with installation Frame 3, the middle of the inner bottom of the mounting frame 3 is provided with a box body 4, the right part of the lower wall of the box body 4 is provided with a discharge pipe 5, the discharge pipe 5 is provided with a first valve 6, and the discharge pipe 5 passes through the installation frame 3 The lower wall, the upper part of the right wall of the mounting frame 3 has a first through hole 7, the upper part of the right wall of the box bo...

Embodiment 2

[0029] A kind of glue preparation equipment for bonding electronic products, such as Figure 1-5 As shown, it includes a bottom plate 1, a pole 2, a mounting frame 3, a box body 4, a discharge pipe 5, a first valve 6, a feed hopper 8, a rack 10, a guide sleeve 11, a guide rod 13, a piston 14, Mounting plate 15, first slide rail 16, first slider 17, bearing housing 18, rotating shaft 19, blade 20, gear 21 and spring 22, base plate 1 top is left and right symmetrically provided with strut 2, and strut 2 top is connected with installation Frame 3, the middle of the inner bottom of the mounting frame 3 is provided with a box body 4, the right part of the lower wall of the box body 4 is provided with a discharge pipe 5, the discharge pipe 5 is provided with a first valve 6, and the discharge pipe 5 passes through the installation frame 3 The lower wall, the upper part of the right wall of the mounting frame 3 has a first through hole 7, the upper part of the right wall of the box b...

Embodiment 3

[0032] A kind of glue preparation equipment for bonding electronic products, such as Figure 1-5 As shown, it includes a bottom plate 1, a pole 2, a mounting frame 3, a box body 4, a discharge pipe 5, a first valve 6, a feed hopper 8, a rack 10, a guide sleeve 11, a guide rod 13, a piston 14, Mounting plate 15, first slide rail 16, first slider 17, bearing housing 18, rotating shaft 19, blade 20, gear 21 and spring 22, base plate 1 top is left and right symmetrically provided with strut 2, and strut 2 top is connected with installation Frame 3, the middle of the inner bottom of the mounting frame 3 is provided with a box body 4, the right part of the lower wall of the box body 4 is provided with a discharge pipe 5, the discharge pipe 5 is provided with a first valve 6, and the discharge pipe 5 passes through the installation frame 3 The lower wall, the upper part of the right wall of the mounting frame 3 has a first through hole 7, the upper part of the right wall of the box b...

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PUM

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Abstract

The invention relates to a preparation device and in particular to an adhesive glue preparation device for an electronic product. Aiming at solving the technical problem, the invention provides the adhesive glue preparation device for the electronic product, the adhesive glue preparation device is time-saving and labor-saving, and uniform in mixing. In order to solve the above technical problem, the provided adhesive glue preparation device for the electronic product comprises a bottom plate, a support rod, an installing frame, a box, a discharging pipe, a first valve, a feeding hopper, a rack, a guide sleeve, a guide rod, a piston, an installing plate, a first sliding rail and the like. The top of the bottom plate is leftwards and rightwards symmetrically provided with the support rod. The top end of the support rod is connected with the installing frame. The middle of the bottom in the installing frame is provided with the box. The right part of the lower wall of the box is providedwith the discharging pipe. The discharging pipe is provided with the first valve. The discharging pipe passes through the lower wall of the installing frame. The adhesive glue preparation device for the electronic product is capable of achieving the effects of saving both time and labor, and uniformly mixing. A blade is continuously moved leftwards and rightwards, and continuously rotated, so rawmaterials in the box are mixed.

Description

technical field [0001] The invention relates to a preparation equipment, in particular to a glue preparation equipment for bonding electronic products. Background technique [0002] Electronic products are related products based on electric energy, mainly including: telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, tape recorders, combination speakers, CD players (CD), computers , mobile communication products, etc. In the production of electronic products, it is often necessary to use glue for bonding, because electronic products are relatively expensive, so the bonding is also very strict, and the quality of the glue is also high, so when preparing the glue, it needs to be very special. Be careful, and the most important step in the preparation of glue is the mixing and stirring of materials. The current mixing method is cumbersome, time-consuming and laborious, and the mixing is uneven. [0003] To sum up, it is currently...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F7/18B01F11/00B01F15/00
CPCB01F27/83B01F27/90B01F31/70B01F31/441B01F35/32005B01F35/3202B01F2101/36
Inventor 陈鲜
Owner 泉州市君贤网络科技有限公司
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