Heat dissipation device of LED lamp and LED lamp
A technology of LED lamps and heat dissipation devices, which is applied to the cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., which can solve the problems of heat conduction failure, weak heat dissipation capacity, thick heat dissipation fins, etc., and achieve stable and efficient heat dissipation , Simple manufacture, strong heat conduction effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0018] Specific implementation mode one: as Figure 1~Figure 6 As shown, the present invention discloses a LED lamp heat dissipation device, which includes a main body mounting shell, a lamp holder 9, two heat dissipation positioning members 5, a plurality of high thermal conductivity rectangular metal sheets 1 6, a plurality of high thermal conductivity rectangular metal sheets 2 7 and A plurality of heat dissipation fins 8, the main body installation shell includes an outer cylinder 1 and an inner cylinder 2 coaxially spaced apart, and the upper and lower ends of the outer cylinder 1 and the inner cylinder 2 respectively pass through The upper sealing ring 3 and the lower sealing plate 4 are bonded and fixed (the upper sealing ring 3 seals the outer cylinder 1 and the upper end of the inner cylinder 2 at intervals, and the lower sealing plate 4 seals all the lower ends of the outer cylinder 1 and the inner cylinder 2), Mercury is injected between the outer cylinder 1 and the...
specific Embodiment approach 2
[0019] Specific implementation mode two: as figure 1 , 3 As shown, this embodiment is a further description of specific embodiment 1. The middle of the outer wall of the outer cylinder 1 is fixed with a plurality of positioning flaps 1-2 along the circumferential direction, and the plurality of positioning flaps 1-2 are 2 are clamped between every two adjacent mounting slots 10 one by one, and fixed to the corresponding positions of the two heat dissipation positioning members 5 by screws.
specific Embodiment approach 3
[0020] Specific implementation mode three: as figure 1 , 3 , 6, this embodiment is a further description of specific embodiment 1 or specific embodiment 2, and each of the high thermal conductivity rectangular metal sheets 6 is provided with a plurality of sockets 6-6 at vertical intervals. 1. The plurality of heat dissipation fins 8 are all provided with the second socket 8-1 matching the first socket 6-1, and the plurality of heat dissipation fins 8 pass through the second socket 8-1 respectively. It is inserted into the socket 1 6-1 corresponding to the high thermal conductivity rectangular metal sheet 1 6 .
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com