Matched assembly type LED lamp heat dissipation device and assembling method thereof

Abstract

The invention discloses a matched assembly type LED lamp heat dissipation device and an assembling method thereof and relates to a heat dissipation device and an assembling method thereof. An outer cylinder and an inner cylinder bond fixedly through an upper seal ring and a lower seal plate. The space between the outer cylinder and the inner cylinder is filled with mercury. The cylinder wall of the outer cylinder is provided with a plurality of first vertical openings. The middles of a plurality of first rectangular high-thermal-conductivity metal sheets are fixed in the corresponding first vertical openings in a sealed bonding mode. The inner end of each first rectangular high-thermal-conductivity metal sheet stretches into the space between the outer cylinder and the inner cylinder. Theshapes of heat dissipation fins are all annular, and the outer ends of the multiple first rectangular high-thermal-conductivity metal sheets are sleeved with the heat dissipation fins in an inserted connection mode. A lampholder fixedly adheres to the inside of the inner cylinder. The cylinder wall of the inner cylinder is provided with a plurality of second vertical openings. The middles of a plurality of second rectangular high-thermal-conductivity metal sheets are fixed in the corresponding second vertical openings in a sealed bonding mode. The outer end of each second rectangular high-thermal-conductivity metal sheet stretches into the space between the outer cylinder and the inner cylinder. The inner end of each second rectangular high-thermal-conductivity metal sheet is tightly attached to the lampholder. Heat conduction transition is conducted with the mercury, and heat dissipation is stable and efficient.

Description

technical field [0001] The invention relates to a heat dissipation device and an assembling method thereof, in particular to a fit-and-assemble LED lamp heat dissipation device and an assembling method thereof. Background technique [0002] In the field of lighting, LED lamps have basically replaced traditional tungsten lamps due to their advantages of energy saving, environmental protection and relatively long service life compared with traditional tungsten lamps. [0003] As we all know, LED lights will generate a lot of heat when they are used, especially high-power LED lights. If the heat generated cannot be discharged in time, it will affect the lighting effect of the LED lights and even shorten the service life. Therefore, the LED light cooling device role is particularly important. [0004] At present, there are generally two types of heat sinks for LED lamps. One is an integrated heat sink that is directly die-cast. This heat sink has thicker fins and weaker heat di...

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Problems solved by technology

[0004] At present, there are generally two types of heat sinks for LED lamps. One is an integrated heat sink that is directly die-cast. This heat sink has thicker fins and weaker heat dissipation due to the production process.

The other is to splice and assemble extruded metal thin-walled parts into a heat sink. This kind of heat sink has thinner fins and stronger heat dissipation capability. However, due to the deformation of metal thin-walled parts, it is easy to produce Poor contact leads to heat conduction failure in some positions

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