Matched assembly type LED lamp heat dissipation device and assembling method thereof

A technology of LED lamps and heat dissipation devices, which is applied to cooling/heating devices of lighting devices, lighting devices, components of lighting devices, etc., can solve the problems of weak heat dissipation, heat conduction failure, poor contact, etc., to avoid heat conduction failure, Stable and efficient heat dissipation

Pending Publication Date: 2018-10-30
江苏泓睿德智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are generally two types of heat sinks for LED lamps. One is an integrated heat sink that is directly die-cast. This heat sink has thicker fins and weaker heat dissipation due to the production process.
The other is to splice and assemble extruded metal thin-walled parts into a heat sink. This kind of heat sink has thinner fins and stronger heat dissipation capability. However, due to the deformation of metal thin-walled parts, it is easy to produce Poor contact leads to heat conduction failure in some positions

Method used

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  • Matched assembly type LED lamp heat dissipation device and assembling method thereof
  • Matched assembly type LED lamp heat dissipation device and assembling method thereof
  • Matched assembly type LED lamp heat dissipation device and assembling method thereof

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specific Embodiment approach 1

[0019] Specific implementation mode one: as Figure 1~Figure 5 As shown, the present invention discloses a fit-and-assemble LED lamp cooling device, including a main body mounting shell, a lamp holder 5, a plurality of high thermal conductivity rectangular metal sheets 1 6, a plurality of high thermal conductivity rectangular metal sheets 2 7 and a plurality of heat dissipation fins Sheet 8, the main body installation shell includes an outer cylinder 1 and an inner cylinder 2 set coaxially at intervals, and the upper and lower ends of the outer cylinder 1 and the inner cylinder 2 respectively pass through the upper sealing ring 3 and the lower sealing plate 4 are bonded and fixed, mercury is injected between the outer cylinder 1 and the inner cylinder 2, and the liquid level of the mercury is lower than the upper surface of the outer cylinder 1 and the inner cylinder 2, and the outer cylinder 1 The middle of the wall is evenly provided with a plurality of vertical gaps 1-1 alo...

specific Embodiment approach 2

[0020] Specific implementation mode two: as image 3 , 4 As shown, this embodiment is a further description of the specific embodiment 1. The outer ends of each of the high thermal conductivity rectangular metal sheets 6 are vertically spaced with a plurality of sockets 6-1, and each of the The inner side of the heat dissipation fin 8 is evenly provided with a plurality of sockets 2 8-1 along the circumferential direction, and the multiple sockets 2 8-1 described in each heat dissipation fin 8 are located on the same plane as a plurality of high thermal conductivity rectangular metal sheets 1 6 A plurality of said plug-in interfaces-6-1 are set up one by one.

specific Embodiment approach 3

[0021] Specific implementation mode three: as image 3 , 5 As shown, this embodiment is a further description of Embodiment 1 or Embodiment 2. Between the lamp holder 5 and the inner cylinder 2 and between each of the heat dissipation fins 8 and the The outer cylinders 1 described above are bonded and fixed with heat-conducting adhesive.

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Abstract

The invention discloses a matched assembly type LED lamp heat dissipation device and an assembling method thereof and relates to a heat dissipation device and an assembling method thereof. An outer cylinder and an inner cylinder bond fixedly through an upper seal ring and a lower seal plate. The space between the outer cylinder and the inner cylinder is filled with mercury. The cylinder wall of the outer cylinder is provided with a plurality of first vertical openings. The middles of a plurality of first rectangular high-thermal-conductivity metal sheets are fixed in the corresponding first vertical openings in a sealed bonding mode. The inner end of each first rectangular high-thermal-conductivity metal sheet stretches into the space between the outer cylinder and the inner cylinder. Theshapes of heat dissipation fins are all annular, and the outer ends of the multiple first rectangular high-thermal-conductivity metal sheets are sleeved with the heat dissipation fins in an inserted connection mode. A lampholder fixedly adheres to the inside of the inner cylinder. The cylinder wall of the inner cylinder is provided with a plurality of second vertical openings. The middles of a plurality of second rectangular high-thermal-conductivity metal sheets are fixed in the corresponding second vertical openings in a sealed bonding mode. The outer end of each second rectangular high-thermal-conductivity metal sheet stretches into the space between the outer cylinder and the inner cylinder. The inner end of each second rectangular high-thermal-conductivity metal sheet is tightly attached to the lampholder. Heat conduction transition is conducted with the mercury, and heat dissipation is stable and efficient.

Description

technical field [0001] The invention relates to a heat dissipation device and an assembling method thereof, in particular to a fit-and-assemble LED lamp heat dissipation device and an assembling method thereof. Background technique [0002] In the field of lighting, LED lamps have basically replaced traditional tungsten lamps due to their advantages of energy saving, environmental protection and relatively long service life compared with traditional tungsten lamps. [0003] As we all know, LED lights will generate a lot of heat when they are used, especially high-power LED lights. If the heat generated cannot be discharged in time, it will affect the lighting effect of the LED lights and even shorten the service life. Therefore, the LED light cooling device role is particularly important. [0004] At present, there are generally two types of heat sinks for LED lamps. One is an integrated heat sink that is directly die-cast. This heat sink has thicker fins and weaker heat di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/77F21V29/76F21V29/89F21V29/58F21V19/00F21Y115/10
CPCF21V29/77F21V19/0015F21V29/58F21V29/76F21V29/89F21Y2115/10
Inventor 付春明熊大曦廖新胜
Owner 江苏泓睿德智能科技有限公司
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