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Method and device for failure type identification

A type identification and type technology, used in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., to solve problems such as difficulty in accurately identifying chip failures

Active Publication Date: 2019-05-24
INTEL PROD CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the value of TCB key parameters is usually affected by many different factors, therefore, the value of TCB key parameters outside the normal value range may be caused by a certain failure of the chip, or it may be caused by other factors
Therefore, it is usually difficult to accurately identify whether a chip has a certain failure caused by a certain TCB event by only using the value of a single TCB key parameter

Method used

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  • Method and device for failure type identification
  • Method and device for failure type identification
  • Method and device for failure type identification

Examples

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Embodiment Construction

[0016] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that the discussion of these implementations is only to enable those skilled in the art to better understand and realize the subject matter described herein, and is not intended to limit the protection scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with respect to some examples may also be combined in other examples.

[0017] As used herein, the term "comprising" and its variants represent open terms meaning "including but not limited to". The...

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Abstract

The invention relates to a method and device for invalid type identification. The method comprises the following steps: acquiring values of multiple TCB key parameters measured in the TCB hot-pressingbonding period of a chip, setting values of specific TCB key parameters for identifying any invalid type caused by the TCB of the chip according to the acquired values of multiple TCB key parameters,wherein any invalid type indicates one specific invalid caused by one TCB event, and the specific TCB key parameter is at least two in multiple TCB key parameters; judging whether the values of multiple specific TCB key parameters are out of the normal value range; if the judgment result is that the values of multiple specific TCB key parameters are out of the normal value range, determining a fact that the chip is in any invalid type. By adopting the method and device disclosed by the invention, the invalid type of the chip can be accurately identified.

Description

technical field [0001] The invention relates to the field of chip manufacturing, in particular to a method and a device for identifying chip failure types. Background technique [0002] Thermal Compression Bonding (TCB: Thermal Compression Bonding) is a high-precision bonding process in the semiconductor packaging industry. It combines silicon wafers on substrates by heating and pressing to manufacture chips. [0003] The TCB has three types of controls: pressure control, temperature control and position control. Pressure control is used to control the pressure applied to the silicon wafer, temperature control is used to control the temperature applied during TCB of the chip, and position control is used to control the position of the silicon wafer placed on the substrate. The entire TCB process of the chip is divided into multiple TCB stages, and one or more of TCB pressure control, temperature control, and position control are performed in each TCB stage. In order to mon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/12H01L22/14H01L22/20
Inventor 侯宗林彭睿博
Owner INTEL PROD CHENGDU CO LTD