Novel mounting device used for mixed pressure polytetrafluoroethylene sandwich layer circuit board

Abstract

The invention discloses a novel mounting device used for a mixed pressure polytetrafluoroethylene sandwich layer circuit board, comprising a chassis fixing plate, wherein fixed sleeve pipes are fixedly connected with the two sides of the top of the chassis fixing plate, a mixed pressure polytetrafluoroethylene sandwich layer circuit board is placed at the top of the chassis fixing plate, and the left side and the right side of the mixed pressure polytetrafluoroethylene sandwich layer circuit board are respectively fixedly connected with a fixed block. The novel mounting device used for the mixed pressure polytetrafluoroethylene sandwich layer circuit board controls displacement of a movable tube in horizontal direction by utilizing front-back displacement of a sliding block which is pulled, then the effect of controlling water placement of a clamping piece is realized, so that inserting blocks at the two sides of the mixed pressure polytetrafluoroethylene sandwich layer circuit board are conveniently inserted into the interiors of grooves of the clamping piece, then a sealing plate of the clamping piece is limited by virtue of displacement in the vertical direction of a baffle, andthen the inserting blocks are clamped, connected and fixed by virtue of the sealing plate, thereby achieving the effects of avoiding extension of a perforating bur while mounting and facilitating mounting, dismounting, repair and maintenance in later period.

Description

technical field [0001] The invention relates to the technical field of mixed-pressure polytetrafluoroethylene core layer circuit board devices, in particular to a novel installation device for mixed-pressure polytetrafluoroethylene core layer circuit boards. Background technique [0002] The mixed-pressed PTFE core layer circuit board is made of mixed-pressed PTFE material, which is characterized by high assembly density, small size, strong heat resistance, and light weight. Due to the high assembly density, each component (including components) ) The connection between the lines is reduced, so the reliability is improved, and the number of wiring layers can be increased, thereby increasing the design flexibility; a circuit with a certain impedance can be formed; a high-speed transmission circuit can be formed; a circuit and a magnetic circuit shielding layer can be set, A metal core heat dissipation layer can also be set to meet the needs of special functions such as shield...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a new type of installation device for the mixed-pressure polytetrafluoroethylene core layer circuit board, which solves the problem that the existing mixed-pressure polytetrafluoroethylene core layer circuit board is generally installed through the drilling screw. It is fixed on the fixed plate of the chassis, and its processing procedure is cumbersome and inconvenient for later repair and maintenance.

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