Semiconductor structure and method for preparing the same
A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor electrical interconnection, complex semiconductor component manufacturing, and component delamination.
Inactive Publication Date: 2018-10-02
NAN YA TECH
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Problems solved by technology
[0003] However, the manufacture of semiconductor components on a miniaturized scale has become increasingly complex
The increased complexity of manufacturing semiconductor components can lead to defects such as poor electrical interconnections, cracks, or delamination of components
Therefore, the modification of the structure and fabrication of semiconductor devices presents many challenges
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[0064] The following description of the disclosure, along with the accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure, although the disclosure is not limited to such embodiments. In addition, the following embodiments may be appropriately integrated with the following embodiments to complete another embodiment.
[0065] "One embodiment," "an embodiment," "exemplary embodiment," "other embodiment," "another embodiment," etc. mean that the embodiments described in this disclosure may include a particular feature, structure, or characteristic, however, Not every embodiment necessarily includes the particular feature, structure, or characteristic. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may be the same embodiment.
[0066] The present disclosure relates to a semiconductor structure covering a chip on a wafer-level chip and a ...
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A semiconductor structure includes a first semiconductor device; at least one conductive member disposed over the first semiconductor device; a second semiconductor device disposed over the first semiconductor device; a molding member disposed over the first semiconductor device; and a redistribution layer (RDL) disposed over the second semiconductor device and the at least one conductive member.The molding member surrounds the second semiconductor device and the at least one conductive member. The molding member does not extend into an interface between the first semiconductor device and thesecond semiconductor device.
Description
technical field [0001] The present disclosure relates to a semiconductor structure and a manufacturing method thereof, in particular to a wafer-level chip-on-chip semiconductor structure and a manufacturing method. Background technique [0002] Semiconductor components are important for many modern applications. With the advancement of electronic technology, the size of semiconductor components is getting smaller and smaller, while the functions are getting larger and larger and the amount of integrated circuits is increasing. Due to the miniaturization of semiconductor elements, chip-on-chip technology is currently widely used for manufacturing semiconductor elements. In the production of this semiconductor package, a number of manufacturing steps are performed. [0003] However, the fabrication of miniaturized-scale semiconductor elements has become increasingly complex. The increased complexity of fabricating semiconductor components can result in defects such as poor ...
Claims
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IPC IPC(8): H01L21/50H01L23/10H01L23/367H01L23/528
CPCH01L21/50H01L23/10H01L23/367H01L23/528H01L21/561H01L23/49816H01L23/5389H01L2224/73265H01L2924/00014H01L2924/15311H01L23/3128H01L2224/48091H01L25/18H01L25/0652H01L25/50H01L2225/06524H01L2225/06527H01L2225/06548H01L2225/06589H01L2224/48227H01L2224/32225H01L24/32H01L24/48H01L2224/12105H01L24/20H01L24/24H01L2224/24137H01L2224/211H01L2224/32145H01L2224/2929H01L2224/29324H01L2224/29339H01L2224/29393H01L24/29H01L2224/73267H01L24/19H01L24/82H01L2224/82106H01L2224/97H01L2224/96H01L2224/94H01L24/96H01L24/94H01L24/97H01L2224/18H01L2224/45099H01L2924/01006H01L2224/83H01L2224/19H01L2224/82H01L2924/0001H01L2924/00H01L24/49H01L25/0657H01L25/105
Inventor 林柏均
Owner NAN YA TECH