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Chemical mechanical polishing machine and chemical mechanical polishing process

A technology of chemical machinery and grinding machine, which is applied in the field of mechanical grinding machine and the process of using this mechanical grinding machine, and can solve the problems that cannot fully meet the needs of various aspects

Active Publication Date: 2021-02-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional chemical mechanical polishing process and equipment can no longer fully meet the needs of various aspects

Method used

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  • Chemical mechanical polishing machine and chemical mechanical polishing process
  • Chemical mechanical polishing machine and chemical mechanical polishing process
  • Chemical mechanical polishing machine and chemical mechanical polishing process

Examples

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Embodiment Construction

[0016] The following disclosure provides many different implementations or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the description, the first feature is formed on or on the second feature, which may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include that additional features may be formed on the second feature. An embodiment between a feature and a second feature such that the first feature and the second feature may not be in direct contact.

[0017] The terms used herein are only used to describe specific embodiments, and are not used to limit the scope of the appended claims. For example, the word "a" or "the" in the singular form may also refer to the plural form unless other...

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Abstract

The invention discloses a chemical mechanical grinding machine and a chemical mechanical grinding manufacture procedure. The chemical mechanical grinding machine comprises a grinding pad, a grinding head and a fluid jetting device; the grinding head is arranged above the grinding pad and is configured to control the wafer to rotate relative to the grinding pad so that the grinding pad can grind the surface of the wafer; the fluid jetting device is arranged above the grinding pad and is configured to eject a fluid to the grinding pad; the fluid jetting device comprises a strip-shaped nozzle anda fluid supply source, the strip-shaped nozzle is provided with a first space and a spray hole communicating with the first space, the spray hole is arranged in the extension direction of the strip-shaped nozzle, the fluid supply source is connected to the strip-shaped nozzle, moreover, the fluid supply source is configured to provide the fluid into the first space so that the fluid can be ejected out from the spray hole.

Description

technical field [0001] The embodiments of the present invention relate to a mechanical polishing machine and a process using the mechanical polishing machine, and in particular to a chemical mechanical polishing machine and a chemical mechanical polishing process. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid growth. In the course of integrated circuit development, functional density (defined as the number of interconnected elements per die area) has generally increased as geometric dimensions have decreased. The miniaturization process generally provides many benefits by increasing production efficiency and reducing associated costs. However, such miniaturization has increased the complexity of handling and manufacturing integrated circuits. To achieve these advances, similar developments in integrated circuit fabrication are required. [0003] For example, as the semiconductor integrated circuit industry has devel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/07B24B37/34B24B57/02
CPCB24B37/07B24B37/34B24B57/02
Inventor 叶书佑陈建置黄俊凱郑穆韩陈慈信
Owner TAIWAN SEMICON MFG CO LTD