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Micro-led display assembly

A LED array and microcolumn technology, which is applied in the direction of electrical components, semiconductor devices, electric solid state devices, etc., can solve the problems of poor chip area utilization, large display size, high cost, etc.

Active Publication Date: 2018-10-09
格芯美国公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional manufacturing methods for LEDs are challenging to meet yield requirements, especially for larger display sizes
Furthermore, higher costs are associated with next-generation displays due to poor wafer area utilization

Method used

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Embodiment Construction

[0014] The present disclosure relates to semiconductor structures, and more particularly, to a micro-LED display component and a manufacturing method thereof. More specifically, the present disclosure relates to a micro LED display assembly consisting of a plurality of arrays of small micro LEDs arranged within a larger array using through silicon via technology. That is, micro LED display assemblies use multiple small dies arranged in an array instead of one large array. Micro LED display components can be used for example in 2.5D and 3D technologies.

[0015] In an embodiment, each small micro LED array includes through silicon via (TSV) technology for mounting onto a substrate to form a larger display assembly. In an embodiment, a TSV is connected to each individual micro-LED, such as a pixel. The TSV micro LED array device can be connected to the pixel driver using a silicon or glass interposer or directly. In an embodiment, a silicon interposer allows direct integratio...

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PUM

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Abstract

The invention relates to micro-LED display assembly. The present disclosure relates to semiconductor structures and, more particularly, to a micro-light emitting diode (LED) display assembly and methods of manufacture. The structure includes an interposer and a plurality of micro-LED arrays each of which include a plurality of through holes connecting pixels of the plurality of micro-LED arrays tothe interposer.

Description

technical field [0001] The present disclosure relates to semiconductor structures, and more particularly, to a micro-LED display component and a manufacturing method thereof. Background technique [0002] Inorganic Light Emitting Diodes (ILEDs) are light emitting diodes made of semiconductor materials. A variety of different colors can be produced using ILEDs, including red, green, yellow and blue. In operation, ILEDs emit light when a forward bias voltage is applied to a P-N junction of semiconductor material. [0003] LED devices for display systems require high pixel placement density on a large surface. However, conventional manufacturing methods for LEDs are challenging to meet yield requirements, especially for larger display sizes. Furthermore, higher costs are associated with next generation displays due to poor wafer area utilization. For the latter point, the use of a single die for large LED displays and image sensor arrays leaves significant unused space arou...

Claims

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Application Information

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IPC IPC(8): H01L27/15
CPCH01L27/15H01L27/156H01L33/18H01L25/167H01L25/0753H01L33/62H01L33/32H01L27/1214H01L33/24
Inventor L·英格兰德B·J·帕夫拉克
Owner 格芯美国公司