Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing ultrasonic fingerprint sensing device and ultrasonic fingerprint sensing device

A manufacturing method and sensing device technology, applied in the directions of acquiring/organizing fingerprints/palmprints, character and pattern recognition, assembling printed circuits with electric components, etc., can solve the problems of easy deformation, influence and connection effect of anisotropic conductive film, Problems affecting the accuracy of the ultrasonic fingerprint sensor device, etc., to achieve the effect of improving working accuracy and avoiding deformation

Inactive Publication Date: 2018-10-09
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ultrasonic sensor is easy to deform under high temperature conditions, which affects the connection effect with the anisotropic conductive film, thereby affecting the accuracy of the ultrasonic fingerprint sensor device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing ultrasonic fingerprint sensing device and ultrasonic fingerprint sensing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0028] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
mechanical propertiesaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for manufacturing an ultrasonic fingerprint sensing device and the ultrasonic fingerprint sensing device. The method comprises a step of pressing an ultrasonic sensorto a flexible circuit board through an anisotropic conductive film in an environment of 100 DEG C to 120 DEG C. The curing temperature of the anisotropic conductive film is less than 120 DEG C. According to the method and the device, the anisotropic conductive film with the curing temperature smaller than 120 DEG C is used to perform a grain soft board bonding technology to encapsulate the ultrasonic fingerprint sensing device, the encapsulation can be performed in a low-temperature environment, thus a condition that an ultrasonic sensor and the flexible circuit board are not tightly pressed caused by the deformation of an ultrasonic sensor in a high-temperature environment is avoided, and the working precision of the ultrasonic fingerprint sensing device is improved.

Description

technical field [0001] The invention relates to the field of fingerprint identification, in particular to a manufacturing method of an ultrasonic fingerprint sensing device and the ultrasonic fingerprint sensing device. Background technique [0002] In the packaging process of the ultrasonic fingerprint sensor device, it is necessary to use an anisotropic conductive film to cure and connect the flexible circuit board and the ultrasonic sensor at high temperature. The ultrasonic sensor is easily deformed under high temperature conditions, which affects the connection effect with the anisotropic conductive film, thereby affecting the accuracy of the ultrasonic fingerprint sensor device. Contents of the invention [0003] An embodiment of the present invention provides a method for manufacturing an ultrasonic fingerprint sensor device, including: [0004] Under the environment of 100°C-120°C, the ultrasonic sensor is bonded to the flexible circuit board through the anisotrop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34G06K9/00
CPCH05K1/181H05K3/34H05K2201/10151G06V40/1306
Inventor 侯美珍吴伟
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com