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Manufacturing method of detecting device

A manufacturing method and detection device technology, applied to measuring devices, using sound waves/ultrasonic waves/infrasonic waves to analyze solids, using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc., can solve problems such as shedding, binder cracking, and distortion

Inactive Publication Date: 2018-10-12
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the complexity of the actual application environment of the structural parts, when the adhesive is used to bond the surface acoustic wave sensor and the metal part to be tested, the adhesive may crack, collapse, etc., resulting in the failure of the surface acoustic wave sensor. , damaged or even fall off
Moreover, due to the need to use adhesives, the sensor chip often cannot be in direct contact with the metal structure. At this time, the structural health information of the metal structure must be transmitted to the sensor chip through the adhesive. The uniformity of the force surface is difficult to control, resulting in large distortion of the information obtained by the sensor chip, resulting in large detection errors and poor repeatability of the sensor

Method used

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no. 1 example

[0033] In view of this, a detection device 10 provided by an embodiment of the present invention, please refer to figure 1 with figure 2 . The detection device 10 includes: a metal structure component 11 to be tested; an acoustic barrier layer arranged on the metal structure component 11; and a surface acoustic wave sensor 14 arranged on the acoustic barrier layer.

[0034] In this embodiment, the detection device 10 integrates the surface acoustic wave sensor 14 with the metal structure component 11 to be tested, that is, the surface acoustic wave sensor 14 is directly designed and prepared on the surface of the metal structure component 11 to be tested, instead of passing through The surface acoustic wave sensor 14 is first prepared on the piezoelectric single crystal substrate, and then pasted on the surface of the metal structural component 11 to be tested, so as to solve the technical problems in the prior art.

[0035] At the same time, considering that when testing the meta...

no. 2 example

[0049] Compared with the first embodiment, the detection device 10 provided in this embodiment is referred to image 3 with Figure 4 The detection device 10 further includes: a buffer film layer 12 arranged between the metal structural component 11 to be tested and the sound barrier layer. That is, the buffer film layer 12 is disposed on the metal structural component 11 to be tested, and the sound barrier layer is disposed on the buffer film layer 12.

[0050] On the one hand, the buffer film layer 12 can make the surface of the metal structure component 11 to be tested have a high level of flatness. Although the surface of the metal structure component 11 to be tested is still relatively rough after being finely polished, by providing a layer of buffer film Layer 12 to improve this state. On the other hand, the buffer film layer 12 can enhance the adhesion between the sound barrier layer and the metal structural component 11 to be tested, so that the surface acoustic wave sens...

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Abstract

The invention relates to a manufacturing method of a detecting device, and belongs to the technical field of microelectronic devices. The manufacturing method comprises the following steps: a metal structural component is to be tested, and a sound blocking layer is arranged on the metal structural component to be tested; and a surface acoustic wave sensor is arranged on the sound blocking layer, wherein when the metal structural component to be tested is tested, the sound blocking layer causes the surface acoustic wave generated by the surface acoustic wave sensor to act on a surface of the metal structural component to be tested. The manufacturing method integrates the surface acoustic wave sensor with the metal structural component to be tested, and solves the technical problems that cracking or collapse and other phenomenon due to usage of the adhesives results in failure, damage or even falling off of the surface acoustic wave sensor; at the same time, the surface acoustic wave generated by the surface acoustic wave sensor is applied to the surface of the metal structural component to be tested by the sound blocking layer, so that the sensor has higher quality factor, resonanceperformance and test sensitivity.

Description

Technical field [0001] The invention belongs to the technical field of microelectronic devices, and specifically relates to a manufacturing method of a detection device. Background technique [0002] Surface acoustic wave devices are very sensitive to changes in physical quantities in themselves and the environment, so they are widely used in various sensing applications, such as temperature sensors, torque sensors, pressure sensors, strain sensors, etc. Generally, when using a surface acoustic wave sensor to detect the structural health of a metal structure (such as whether there is strain, cracks, or damage), the surface acoustic wave sensor needs to be pasted on the surface of the metal structure. The pasting method used is tin Welding, ceramic glue bonding, chemical adhesive bonding, etc. However, because the actual application environment of structural parts is relatively complicated, when adhesives are used to bond the surface acoustic wave sensor and the metal part to be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04
CPCG01N29/041G01N2291/0234
Inventor 舒琳吴卫东王雪敏阎大伟罗跃川王进
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS