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PCB electroplating method

A technology of PCB board and current density, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as increasing scrap cost, copper thickness not meeting customer requirements, affecting product quality, etc.

Inactive Publication Date: 2018-10-12
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] The copper thickness on the PCB board will directly affect its performance, so it is necessary to ensure that the copper thickness formed on the PCB board after electroplating meets customer requirements, but the traditional PCB board electroplating method has defects, resulting in the copper thickness after electroplating cannot meet customer requirements, affecting Improve product quality and increase scrap costs

Method used

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  • PCB electroplating method

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Embodiment Construction

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention discloses a PCB electroplating method. The method comprises the following steps of forming a hole in a PCB; setting electroplating parameters; performing electroplating on the PCB according to the electroplating parameters, wherein the electroplating parameters comprise an electroplating area which is equal to sum of the area of the inner wall of the hole in the PCB and the surface area of the PCB. By virtue of the PCB electroplating method, the area of the inner wall of the hole in the PCB and the surface area of the PCB are both counted into the electroplating area in designingof the electroplating parameters, so that a more accurate electroplating area can be obtained; and the electroplating area is one of factors which determine copper thickness after electroplating, sothat electroplating parameter error can be lowered by virtue of the more accurate electroplating area, and quality of the PCB is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a PCB board electroplating method. Background technique [0002] With the rapid development of electronic products in the direction of miniaturization, high density, high integration and multi-function, the requirements for printed circuit boards are getting higher and higher, and the PCB manufacturing process also needs to be more refined. [0003] The copper thickness on the PCB board will directly affect its performance, so it is necessary to ensure that the copper thickness formed on the PCB board after electroplating meets customer requirements, but the traditional PCB board electroplating method has defects, resulting in the copper thickness after electroplating cannot meet customer requirements, affecting The quality of the product has been improved, and the cost of scrapping has been increased. Contents of the invention [0004] Based on this, the p...

Claims

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Application Information

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IPC IPC(8): H05K3/02
CPCH05K3/022
Inventor 李哲谢添华高航周明贤
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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