Fabrication integral machine of sliding table wrinkled PCB electronic device

Abstract

The invention discloses a fabrication integral machine of a sliding table wrinkled PCB electronic device. The fabrication integral machine comprises a support and a first cushion plate and also comprises two sliding mechanisms and a beam plate, wherein the beam plate is fixed on the sliding mechanisms, the fabrication integral machine also comprises a lifting mechanism, the lifting mechanism comprises a servo motor and a sliding table, the sliding table is arranged on the servo motor, a first micro piezoelectric stack is arranged at the sliding table, a support seat is arranged at the first micro piezoelectric stack and is in shaft connection with a first wrinkled rolling shaft, the fabrication integral machine also comprises a second cushion plate, a second micro piezoelectric stack is arranged on the second cushion plate, the fabrication integral machine also comprises a pulling cylinder mechanism, the pulling cylinder mechanism comprises a first cylinder vertical plate, a first power cylinder and a second wrinkled rolling shaft, inclined lines are respectively arranged at the second wrinkled rolling shaft and the first wrinkled rolling shaft, the line directions of the second wrinkled rolling shaft and the first wrinkled rolling shaft are opposite, and the lines also have radian. The fabrication integral machine is simple in structure, high in efficiency and low in cost andis suitable for production on a large scale.

Description

technical field [0001] The invention relates to the technical field of electronic device preparation, in particular to a sliding table folded PCB electronic device preparation machine. Background technique [0002] With the development of the electronics industry, wrinkled PCBs have gradually entered people's field of vision. Wrinkled PCBs are flexible, bendable and stretchable, so they are suitable for wearable devices, stretchable display devices and biocompatible medical devices. Emerging fields such as devices have great practical value. [0003] However, in the existing preparation of wrinkled PCBs, the process performance is not uniform enough and the stability is poor, and the preparation by photolithography and laser ablation is expensive and time-consuming, and is not suitable for large-scale production. Both of these two preparation methods will cause different degrees of damage to the base film of the electronic device, which will affect the quality and reliabili...

AI Technical Summary

Problems solved by technology

[0003] However, in the existing preparation of wrinkled PCBs, the process performance is not uniform enough and the stability is poor, and the preparation by photolithography and laser ablation is expensive and time-consuming, and is not suitable for large-scale production. Both of these two preparation methods will cause varying degrees of damage to the base film of electronic devices, which will affect the quality and reliability of the wrinkled PCB.

Images