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Bonding device

A bonding and adhesive technology, applied in the direction of seams of textile materials, textiles and papermaking, tools for sewing clothes, etc. , It is difficult to stably convey the lower sheet and the upper sheet, etc.

Active Publication Date: 2019-12-17
BROTHER KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the force of the operator holding the lower sheet and the upper sheet is too large, there is a possibility that the upper sheet and the lower sheet are pulled by the operator and deviate in the left-right direction, and the upper sheet and the lower sheet wrinkle
When the force holding the lower sheet and the upper sheet by the operator is too small, there is a possibility that the right end of the lower sheet deviates from the lower sheet guide, and the left end of the upper sheet deviates from the upper sheet guide, causing the lower sheet to The amount of overlap between the top sheet and the top sheet is uneven
Therefore, it may be difficult for the bonding device to maintain the positional relationship between the right end of the lower sheet and the left end of the upper sheet with respect to the nozzles, and it may be difficult to stably convey the lower sheet and the upper sheet.

Method used

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Embodiment Construction

[0052] Embodiments of the present invention will be described. The following description uses left and right, front and rear, and up and down shown by arrows in the drawings. Bonding device 1 utilizes adhesive Z (refer to Figure 22 ) to bond the two sheets together. Two sheets are lower sheet 8 and upper sheet 6 (referring to Figure 18 ). The upper sheet 6 overlaps the lower sheet 8 from above. The lower sheet 8 and the upper sheet 6 are, for example, flexible cloth. The bonding apparatus 1 of the present embodiment bonds the right end portion of the lower sheet 8 , that is, the lower specified end portion 8A, and the left end portion of the upper sheet 6 , that is, the upper specified end portion 6A with the adhesive Z.

[0053] refer to Figure 1 to Figure 14 The mechanical structure of the bonding apparatus 1 will be described. like Figure 1 ~ Figure 3 As shown, the bonding device 1 has a base part 2 , a pillar part 3 , an arm part 4 and a head part 5 . The base...

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Abstract

The invention relates to a bonding device. The bonding apparatus has a lower nip roller, an upper nip roller, a support member, a lower detection unit, and an upper detection unit. The lower pinch roller and the upper pinch roller can rotate axially in the front-rear direction. The lower pinch roller pinches the right end portion of the lower sheet, that is, the lower specific end portion, between it and the supporting member. The upper pinch roller pinches the left end portion of the upper sheet, that is, the upper specific end portion, between it and the supporting member. The lower detection unit detects whether the lower specific end is located at a lower detection position which is a predetermined position, and the upper detection unit detects whether the upper specific end is located at an upper detection position which is a predetermined position. The bonding apparatus switches the rotation directions of the lower nip roller and the upper nip roller according to the detection results of the lower detection unit and the upper detection unit.

Description

technical field [0001] The invention relates to a bonding device. Background technique [0002] A bonding device is known for bonding two sheets to each other by means of an adhesive. The bonding apparatus disclosed in Japanese Patent Laid-Open No. 122262 of 2011 includes a nozzle, an upper transport roller, a belt, and guide members for both edges. Nozzles are used to discharge adhesive to the lower sheet. The upper conveying roller conveys the lower sheet and the upper sheet while pressing the upper sheet and the adhesive-coated lower sheet between the upper conveyance roller and the belt. The guide member for both edges has a lower sheet guide and an upper sheet guide. The operator inserts the right end of the lower sheet into the lower sheet guide for positioning, and inserts the left end of the upper sheet into the upper sheet guide for positioning. [0003] In the bonding apparatus described above, the operator needs to hold the conveyed lower sheet and upper sheet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A41H43/04
CPCA41H43/04B29C65/4815B29C65/524B29C65/7832B29C65/7894B29C66/1122B29C66/43B29C66/729B29C66/81465B29C66/8167B29C66/83413B29C66/845B29C66/872B29C66/9672D06H5/00
Inventor 柴田到岩越弘恭梅田和俊
Owner BROTHER KOGYO KK