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Hot-press protection release colloid and uses of the same

一种离型胶、离型膜的技术,应用在胶粘剂、粘合剂类型、聚脲/聚氨酯粘合剂等方向,能够解决硅油析出、层板或芯片伤害、工艺适用条件限制等问题,达到轻易离型、解决段差的效果

Active Publication Date: 2018-10-23
TECH ADVANCE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, one type of protective release film is to use silica resin as the main component of the adhesive layer, but this kind of protective release film is prone to the problem of silicone oil precipitation after hot pressing, and it will be difficult to form in the subsequent circuit preparation The problem
The other type is to use Teflon (polytetrafluoroethylene), but Teflon only provides a release function, and Teflon will cause damage to the environment, which is not conducive to the use of green factories
Another type of protective release film is UV-curable protective release film, which is irradiated with ultraviolet light to further polymerize after protective lamination to improve the peeling effect, but the use of this protective release film makes the process more advanced. It is complex, and ultraviolet light is easy to cause damage to laminates or chips during application. In addition, its high-temperature hot-pressing temperature resistance is poor, so there are restrictions on the applicable conditions of the process

Method used

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  • Hot-press protection release colloid and uses of the same
  • Hot-press protection release colloid and uses of the same
  • Hot-press protection release colloid and uses of the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0041] Preparation method of protective release film for hot pressing

[0042] The present invention additionally provides a method for preparing the above-mentioned protective release film for hot pressing, the method comprising: performing a heating and drying procedure and the aforementioned aging procedure on the protective release adhesive for hot pressing of the present invention to form a protective release film for hot pressing. Protective release layer, wherein, the protective release layer for hot pressing can be formed separately, or can be coated with a protective release adhesive for hot pressing on the surface of a substrate, and then carry out the heating and drying process and the aging process to form formed on the surface of the substrate.

[0043] The heating method, heating temperature and heating time of the above-mentioned heating and drying procedure are not particularly limited, as long as most of the solvent of the protective release adhesive for hot p...

Embodiment 1

[0088] [Example 1: Preparation of protective release film for hot pressing]

[0089] Use protective release adhesive 1 for hot pressing to protective release adhesive 4 for hot pressing, and protective release adhesive 1 for comparative hot pressing and protective release adhesive 2 for comparative hot pressing to prepare protective release film for hot pressing 1 to protective release film 4 for hot pressing, and protective release film 1 for comparison hot pressing and protective release film 2 for comparative hot pressing. First, the protective release adhesive for hot pressing 1 to the protective release adhesive for hot pressing 4 and the protective release adhesive for hot pressing 1 and the protective The release adhesive 2 is respectively coated on the PET substrate, heated and dried at 180°C for 2 to 5 minutes to form a protective release layer for hot pressing on the surface of the PET substrate, and then the following aging procedure is carried out to obtain a hot p...

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PUM

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Abstract

A hot-press protection release colloid for applying on a surface of an object to be hot-pressed is provided. The hot-press protection release colloid includes an acrylate-based resin, a polymeric isocyanate component, and a solvent, wherein the amount of the polymeric isocyanate component is 1 to 30 parts by weight per 100 parts by weight of the acrylate-based resin, and wherein the hot-press protection has a viscosity of 10,000 to 500,000 cP.

Description

technical field [0001] The present invention relates to a protective release adhesive for hot pressing, in particular to a protective release adhesive for hot pressing using acrylate resin and polymeric isocyanate component (polymeric isocyanate component) in a specific ratio and using the hot pressing A protective release film for hot pressing formed with a protective release adhesive, and their application in a hot pressing process. Background technique [0002] Recently, due to the extensive increase and complexity of electronic products, the contact distance of circuit components has become smaller, the number of connections has become higher, and the length of wiring between points has been locally shortened, so high-density circuit configuration and microvia technology must be used to manufacture related electronic products. Since the wiring and jumper are basically difficult to achieve for single-sided or double-sided, the electronic components are multi-layered. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J7/40C08J7/043C08J7/044C08J7/05
CPCC09J175/04C09J2467/006C09J2475/00C09J2475/006C09J2477/006C09J2479/086C09J2423/046C09J2401/006C09J2400/163C08J5/18C08J2375/04C08J7/0427C08J7/05C08J7/043C08J7/044H05K1/0353
Inventor 黄俊智
Owner TECH ADVANCE IND
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