LED light source glue filling die and method

A technology of LED light sources and molds, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as being knocked off, affecting production efficiency, poor packaging, etc., and achieve the effect of improving production efficiency

Pending Publication Date: 2018-11-02
SHENZHEN DICOLOR OPTOELECTRONICS
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the SMD LED lamp is applied to the display screen, it is directly exposed, so it is inevitable that it may be knocked off. In order to solve the above problems, the current method is to cure and seal the SMD LED lamp to prevent the single LED from being damaged. The lamp was knocked off
[0004] However, the existing curing and sealing method is to cure in the form of natural drying after the glue is filled in the mold. The curing time is as long as several hours, which takes a long time and seriously affects the production efficiency.
However, in the existing packaging process, air bubbles will appear, resulting in poor packaging

Method used

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  • LED light source glue filling die and method
  • LED light source glue filling die and method
  • LED light source glue filling die and method

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0028] The LED light source is the light-emitting diode light source. In order to describe the aspect, the light-emitting diode light source is referred to as the LED light source for short throughout the text. It is widely used because of its high brightness and low power consumption, and it specifically includes a PCB board, an LED lamp bead arranged on the PCB board and coupled with a driver chip through the PCB board. Generally, the driver chip and the LED lamp bead are separate...

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Abstract

The invention discloses an LED light source glue filling die and method. During glue injection, an upper die and a lower die are at least partially completely buckled to form a closed space for containing an LED light source fixed to the lower die. Exhaust through holes and through hole covers are arranged on the two sides of the upper die, wherein the exhaust through holes and the through hole covers are consistent in size and number, the exhaust through holes are used for vacuum pumping of the closed space, and the through hole covers are used for sealing the exhaust through holes after vacuum pumping. Glue injection holes are formed between the exhaust through holes in the two sides of the upper die and used for fully filling packaging glue into the closed space. Air bubbles can be effectively prevented from appearing in the glue packaging process, and the packaging yield is improved.

Description

technical field [0001] The present application relates to the LED display field, in particular to a glue filling mold and a glue filling method for an LED light source. Background technique [0002] At present, the packaging methods of LED light sources on the market mainly include in-line LED lights with brackets, SMD LED lights and integrated LED module lights. [0003] The in-line LED lamp is composed of light-emitting chips, copper or iron brackets, and epoxy resin. It is characterized by various forms, easy replacement, and a wide range of light-emitting angles. light source. When the bracket LED lights form a module, a single plug-in welding is required, the installation is cumbersome, and the cost is high. Chip type SMD LED lamp is a kind of chip carrier with plastic package lead, which is characterized by small size, thinness, wide application range; firm package, good heat dissipation, and high reliability, so it has been the most widely used, such as Use SMD pac...

Claims

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Application Information

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IPC IPC(8): B29C39/10B29C39/42B29C39/38H01L33/52
CPCH01L33/52B29C39/10B29C39/38B29C39/42
Inventor 吴明金王周坤徐陈爱
Owner SHENZHEN DICOLOR OPTOELECTRONICS
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