A semiconductor diode pin forming device

Abstract

The invention belongs to the technical field of semiconductor diode manufacturing, in particular to a semiconductor diode pin forming device. The semiconductor diode pin forming device comprises a fixed base, a lower die, a bending module, a dust removal module, an upper die and a compressing module; the lower die is slidably connected in a cavity in the top of the fixed base; the bending module is hinged to the two sides of the top of the lower die, and the dust removal module is arranged on the non-hinged side of the bending module; the bottom of the dust removal module is fixedly connectedto the step surface of the fixed base; the upper die is arranged above the lower die; the top of the upper die is fixedly connected with the output end of a crimping machine; and the two sides of theupper die are fixedly connected with the compressing module. According to the semiconductor diode pin forming device, the bending module is hinged to the two sides of the top of the lower die, so thatwhen the lower die moves downwards, the bending module swings around the hinged position to realize pin bending; meanwhile, the bending angle of the bending module can be adjusted; and the dust removal module is arranged on the non-hinged side of the bending module, so that dust in the number one positioning groove of the bending module can be removed.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode manufacturing, in particular to a semiconductor diode pin forming device. Background technique [0002] Diode bending foot forming process is already a relatively mature process in the market, and there are also various automation equipment, which can solve the forming process of product diversification. But the disadvantages are also obvious. It is suitable for products with large quantities and few varieties, and it must be a braided product. There are also limitations on the thickness of the pins, and it cannot be popularized to all products. And the equipment cost is also high, it is impossible to standardize and automate the production of all products used. Usually, for small-batch products and repairs and supplements, most of them are carried out by manual bending. This method is difficult to guarantee dimensional accuracy, affects product quality, and is inefficient and labor-i...

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Problems solved by technology

However, in this solution, the pins rub against the lower mold during bending, which leads to scratches on the pins, which in turn leads to quality problems; the bending angle of the pins cannot be adjusted, and the bending fillet of the pins cannot be adjusted, which leads to the inapplicability of the product. Low stability; the dust in the positioning groove cannot be cleaned in time after bending

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