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Novel soldering paste and preparation method thereof

A solder paste, a novel technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of complex manual pressing process, bulky pressing machine, and shorten the service life of the pressing machine, so as to increase the convenience of moving and handling performance, increase the safety of equipment use, and increase the effect of equipment stability

Inactive Publication Date: 2018-11-06
广州星引科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When preparing and producing solder paste, it is necessary to press the solder paste to ensure the stability of the solder paste. Manual pressing and mechanical pressing are usually used for solder paste pressing. The manual pressing process is complex and time-consuming. , although the traditional pressing machine is very efficient, but the traditional pressing machine has problems such as bulky, inflexible movement, etc., it is inconvenient to use, and the exposed design of the transmission system brings greater safety hazards to users. There is a lot of wear and tear during the movement or transportation of the laminating machine, which greatly reduces the service life of the laminating machine

Method used

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  • Novel soldering paste and preparation method thereof
  • Novel soldering paste and preparation method thereof

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Embodiment Construction

[0014] Combine below Figure 1-2 The present invention will be described in detail.

[0015] refer to Figure 1-2 , a novel solder paste and a preparation method thereof according to an embodiment of the present invention, comprising preparing a housing 100, a placement cavity 122 is provided in the bottom end surface of the preparation housing 100, and a placement cavity 122 is provided in the top wall of the placement cavity 122. There is an adjustment groove 102, an adjustment seat 101 is installed in the adjustment groove 102, and a first sliding cavity 141 is arranged in the bottom end surface of the adjustment seat 101, and a pressing column 143 is installed in the first sliding cavity 141 , the pressing column 143 extends into the placement cavity 122 and the bottom end is fixed with a pressing plate 142, and the inner walls of the left and right sides of the first sliding cavity 141 are symmetrically provided with guide grooves 137, and sliding in the guide grooves 13...

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Abstract

The invention discloses novel soldering paste and a preparation method thereof. A preparation shell is included. The bottom end face of the preparation shell is internally provided with a storage cavity. The inner top wall of the storage cavity is internally provided with an adjusting groove. The adjusting groove is internally provided with an adjusting base in a sliding fit manner. The bottom endface of the adjusting base is internally provided with a first sliding cavity. The first sliding cavity is internally provided with a pressing column in a sliding fit manner. The pressing column extends into the storage cavity, and the bottom tail end of the pressing column is fixedly provided with a pressing plate. The left inner wall and the right inner wall of the first sliding cavity are internally and symmetrically provided with guide grooves. The guide grooves are internally provided with guide blocks in a sliding fit manner, and the guide blocks are fixedly connected with the pressingcolumn. The parts, at the bottom ends of the guide blocks, of the guide grooves are internally provided with first elastic strips in a jacking pressure fit manner. The inner top wall of the first sliding cavity is internally provided with a pressure cavity. The right side of the pressure cavity is provided with a first piston block in an up-down sliding fit manner.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a novel solder paste and a preparation method thereof. Background technique [0002] When preparing and producing solder paste, it is necessary to press the solder paste to ensure the stability of the solder paste. Manual pressing and mechanical pressing are usually used for solder paste pressing. The manual pressing process is complex and time-consuming. , although the traditional pressing machine is very efficient, but the traditional pressing machine has problems such as bulky, inflexible movement, etc., it is inconvenient to use, and the exposed design of the transmission system brings greater safety hazards to users. There is a lot of wear and tear in the process of moving or transporting the laminating machine, which greatly reduces the service life of the laminating machine. Contents of the invention [0003] The object of the present invention is to provide a novel so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 陆伟城
Owner 广州星引科技有限公司
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