Ruthenium palladium alloy electroless plating solution and its plating method and application
A technology of chemical plating solution and palladium alloy, applied in the field of chemical plating, can solve the problems of difficult control of reaction rate, poor solderability of pure ruthenium layer, inability to realize ruthenium-palladium alloy plating, etc. mild effect
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Embodiment 1
[0024] This embodiment provides a palladium-ruthenium alloy electroless plating solution and a method for electroless plating a ruthenium-palladium alloy layer. The components contained in the palladium-ruthenium alloy electroless plating solution are shown in Table 1 below. Wherein, the plating method of described palladium-ruthenium alloy electroless plating solution or the method for electroless plating ruthenium-palladium alloy layer comprise the steps:
[0025] After the circuit board with nickel as the base pad is properly surface activated, the step of electroless palladium ruthenium alloy plating is performed. The composition and conditions of the electroless palladium ruthenium alloy plating solution are shown in Table 1. After the pH of the solution is adjusted to the set value with citric acid or ethylenediamine solution, it is heated to the plating temperature of 65°C. After 5 minutes of electroless plating, the plated parts are taken out, cleaned and dried, and an...
Embodiment 2
[0029] This embodiment provides a palladium-ruthenium alloy electroless plating solution and a method for electroless plating a ruthenium-palladium alloy layer. The components contained in the palladium-ruthenium alloy electroless plating solution are shown in Table 2. Wherein, the plating method of described palladium-ruthenium alloy electroless plating solution or the method for electroless plating ruthenium-palladium alloy layer comprise the steps:
[0030] Plating was carried out with reference to the plating method of Example 1, wherein, except that the plating time was changed to 15 minutes, all other processing steps and the electroless plating process were the same as in Example 1. After the electroless plating is completed, the weldability is good through analysis and testing, the thickness of the palladium-ruthenium alloy layer increases to about 0.35 μm, the ruthenium content is about 60%, the palladium content is about 40%, and the plating solution remains stable dur...
Embodiment 3
[0034] This embodiment provides a palladium-ruthenium alloy electroless plating solution and a method for electroless plating a ruthenium-palladium alloy layer. The components contained in the palladium-ruthenium alloy electroless plating solution are shown in Table 3 below. Wherein, the plating method of described palladium-ruthenium alloy electroless plating solution or the method for electroless plating ruthenium-palladium alloy layer comprise the steps:
[0035] After proper surface activation of the copper-based device, a palladium-ruthenium alloy electroless plating step is performed. The composition and conditions of the electroless plating solution are shown in Table 3. After the pH of the solution is adjusted to the set value with citric acid or ethylenediamine solution, it is heated to a plating temperature of 60°C. After 20 minutes of electroless plating, the plated parts are taken out and cleaned and dried. After analysis and testing, the metal layer Strong bindin...
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Abstract
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