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Electronic tag for cable and pasting method for electronic tag

An electronic label and cable technology, applied in labeling, marking slender objects, record carriers used by machines, etc., can solve the problems of low paste efficiency, high production cost, and weak paste.

Pending Publication Date: 2018-11-06
石家庄杰泰特动力能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the cable electronic label substrates in the prior art are made of PVC, ABS and other materials by injection molding. They are directly pasted with double-sided adhesive or high-strength glue or fixed on the surface of the cable with straps. The paste efficiency is low and the paste is not firm. Problems such as high production cost and easily damaged chips

Method used

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  • Electronic tag for cable and pasting method for electronic tag
  • Electronic tag for cable and pasting method for electronic tag

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] Such as figure 1 , figure 2 As shown, an electronic label for cables includes: an electronic label body and a double-sided adhesive layer. Adhesive layer 1 and release paper 2, the foam adhesive layer is pasted on the bottom end face of the electronic label body, the electronic label body includes the label inner core 3 and the label carrier 4 wrapped outside the label inner core, two ends of the label carrier are arranged Glue injection through hole 5, the glue injection through hole is located outside the inner core of the label, and the position where the foam adhesive layer is opposite to the two glue injection through holes is provided with a reinforced adhesive hole 6, and the cross-sectional area of ​​the reinforced adhesive hole is larger than that of the glue injection The through hole, the reinforced adhesive hole 6 communicates with the glue injection through hole 5, and the thickness of the foam adhesive layer is 0.5-2 mm. The foam adhesive layer is a r...

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PUM

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Abstract

The invention provides an electronic tag for a cable and a pasting method for the electronic tag. When the electronic tag for the cable is produced, a reinforced adhesive hole for accommodating high-strength adhesive is reserved in a foam adhesive layer of a double-sided adhesive layer; meanwhile, glue injecting through holes are formed in two ends of a tag carrier outside an electronic tag body,are formed in the tag carrier on the outer side of a tag inner core and have no influence on the performance of the tag inner core. According to the pasting method provided by the invention, a two-stage reinforced pasting method is adopted; and the electronic tag body is quickly pasted and fixed on the surface of the cable by using the foam adhesive layer, and then second reinforced pasting is realized by using the high-strength adhesive with lower solidification velocity, so that the pasting efficiency is greatly improved. During primary pasting, the foam adhesive layer realizes a preliminarypasting effect and can be timely changed if found to have faults. The high-strength adhesive is used for second reinforced pasting, and the electronic tag body can be tightly combined with the outersurface of the cable, so that standard requirements of power industry are met.

Description

technical field [0001] The invention relates to the technical field of power facilities, in particular to an electronic label for cables and a sticking method thereof. Background technique [0002] The cable electronic label adopts a non-contact microchip automatic identification technology, which can intelligently and precisely manage the cable operation data, can work in various harsh environments, is durable, and the information is not easy to lose, which can effectively ensure the on-site cable operation Consistency of state and information systems. Most of the cable electronic label substrates in the prior art are made of PVC, ABS and other materials by injection molding. They are directly pasted with double-sided adhesive or high-strength glue or fixed on the surface of the cable with straps. The paste efficiency is low and the paste is not firm. The production cost is high, and the chip is easily damaged. Contents of the invention [0003] One of the objectives of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077B65C3/02
CPCG06K19/077B65C3/02
Inventor 董玮赵培张其君王海亮
Owner 石家庄杰泰特动力能源有限公司