Chip data self-destruction package structure

Abstract

The invention provides a chip data self-destruction package structure. The chip data self-destruction package structure destroys data in an ineffective memory via the heat generated in a package and disassembly process. The chip data self-destruction package structure comprises a memory unit comprising a thermal failure memory that automatically erases data above a certain temperature; and a heatconductor that conducts the heat generated in the package and disassembly process to the thermal failure memory.

Description

technical field [0001] The invention belongs to the field of chip packaging, in particular to a packaging technology for erasing sensitive data in the chip when the chip is illegally cracked. Background technique [0002] The data in the chip requires self-destruction of the data when the chip is found to be illegally disassembled in some applications. The steps of cracking the chip data are as follows: the chip disassembly step first removes the chip from the device side, unpacks the chip, and uses the probe to read the data inside the chip. For the disassembly process, the corresponding protection methods are divided into three levels: device-level anti-disassembly technology, package-level anti-disassembly technology, and chip-level anti-disassembly technology. [0003] The device-level dismantling technology is to add dismantling sensors on the device to detect dismantling actions such as knocking and impact detection. Once dismantling is found, the internal power suppl...

AI Technical Summary

Problems solved by technology

[0004] The chip-level circuit cannot be read by increasing the complexity of the chip circuit, making it difficult to modify the chip circuit to read the internal data of the chip

In essence, it only increases the complexity of data reading, but it cannot effectively block the behavior of data reading, and actually does not destroy data

[0005] At present, the corresponding protection is carried out at the chip package level, and no effective defense measures have been proposed for package-level dismantling.

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