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Protective film-forming composite sheet

A technology of protective film and composite sheet, which is applied in the direction of film/sheet adhesive, synthetic resin layered products, coating, etc., which can solve the problem of unclear laser printing and achieve the effect of inhibiting adhesion

Pending Publication Date: 2018-11-09
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the thickness of the adhesive layer 12 is insufficient, the concave-convex shape of the base material 81 is reflected so that the surface (rear surface) 13b of the support sheet 80 side of the protective film forming film 13 has a concave-convex shape, and there is a problem with the protective film. The problem that the laser printing performed on the support sheet side surface of the protective film formed by the formation film 13 becomes unclear

Method used

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  • Protective film-forming composite sheet
  • Protective film-forming composite sheet
  • Protective film-forming composite sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0580] made figure 1 A composite sheet for forming a protective film having the configuration shown above. A plan view of the composite sheet for forming the protective film is shown in image 3 . More specifically, as described below.

[0581] [Manufacture of the first laminate]

[0582] (Preparation of thermosetting protective film-forming composition)

[0583] The following components were mixed in the following amounts (solid content), and methyl ethyl ketone was further mixed to obtain a protective film forming composition (III-1) having a solid content concentration of 51% by mass.

[0584] (polymer component (A))

[0585] (A)-1: Acrylic resin (weight average Molecular weight 400000, glass transition temperature -1°C) 150 parts by mass

[0586] (Thermosetting component (B))

[0587] ·Epoxy resin (B1)

[0588] (B1)-1: 60 parts by mass of bisphenol A epoxy resin ("JER 828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 183 to 194 g / eq, molecula...

Embodiment 2

[0624] As shown in Table 1, a composite sheet for forming a protective film was obtained in the same manner as in Example 1, except that a base material having a surface roughness Ra of the uneven surface of 1 μm was used instead of 0.4 μm.

Embodiment 3

[0626] As shown in Table 1, the surface roughness Ra of the uneven surface was used as the base material instead of 0.4 μm, and the thickness of the coating layer was 1 μm instead of 3 μm. In the same manner as in Example 1, A composite sheet for forming a protective film was obtained by the method.

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Abstract

This protective film-forming composite sheet is provided with a protective film-forming film on one surface of a support sheet, and is provided with a coating layer on the surface of the support sheeton the side opposite of where the protective film-forming film is provided, wherein the gloss value of the surface of the coating layer opposite of the side contacting the support sheet is 32-95.

Description

technical field [0001] The present invention relates to a composite sheet for forming a protective film for forming a protective film on the back surface of a semiconductor chip. [0002] This application claims priority based on Japanese Patent Application No. 2016-042690 for which it applied in Japan on March 4, 2016, and uses the content here. Background technique [0003] In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In the flip-chip method, a semiconductor chip having electrodes such as bumps on a circuit surface, and the electrodes are bonded to a substrate can be used. Therefore, the back surface of the chip opposite to the circuit surface may be exposed. [0004] On the back surface of the exposed chip, a resin film made of an organic material is sometimes formed as a protective film, and is mounted in a semiconductor device as a semiconductor chip with a protective film. The protective f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00C09D201/00C09J201/00C09J7/20
CPCC09J7/29C09J133/00H01L21/6836B32B33/00B32B7/12H01L2221/68327B32B27/00C09D201/00C09J201/00C09J7/20H01L23/28B32B2255/10B32B2255/26B32B2307/748B32B2307/406
Inventor 佐伯尚哉佐佐木辽米山裕之山本大辅
Owner LINTEC CORP