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Supporting sheet and composite sheet for protective film formation

A support sheet and protective film technology, applied in the direction of film/sheet adhesive, synthetic resin layered products, chemical instruments and methods, etc., can solve the problem that the adhesive layer is easy to vibrate and cannot obtain semiconductor wafers or semiconductor chips Check images, unclear printing and other problems to achieve the effect of inhibiting adhesion

Active Publication Date: 2018-12-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, if the pressure-sensitive adhesive layer is thin, the uneven shape of the surface of the substrate is reflected, and the surface (back surface) of the film for forming a protective film on the substrate side becomes an uneven surface.
In this way, if the protective film is formed from the film for protective film formation which has the disadvantage that the embedding of the uneven shape on the surface of the base material becomes insufficient, if laser printing is performed on the surface on the side of the support sheet, the printed characters will be changed. not clear
In addition, clear inspection images of semiconductor wafers or semiconductor chips cannot be obtained
On the other hand, when the adhesive layer is too thick, since, for example, the adhesive layer in the cutting process in the dicing process is likely to vibrate, the semiconductor chip, the semiconductor chip in the cutting process of forming a semiconductor chip, etc. Wafers are also prone to vibration, and there is a problem that when excessive force is applied to these semiconductor chips and semiconductor wafers, cracks and chips are likely to occur on the semiconductor chips (prone to chipping)

Method used

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  • Supporting sheet and composite sheet for protective film formation
  • Supporting sheet and composite sheet for protective film formation
  • Supporting sheet and composite sheet for protective film formation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0436] (Manufacture of thermosetting protective film-forming composition (III-1))

[0437] Polymer component (A)-1 (40 parts by mass), epoxy resin (B1)-1 (5 parts by mass), epoxy resin (B1)-2 (4 parts by mass), epoxy resin (B1)- 3 (10 parts by mass), thermosetting agent (B2)-1 (1 part by mass), curing accelerator (C)-1 (1 part by mass), filler (D)-1 (36 parts by mass), coupling Agent (E)-1 (1 part by mass) and colorant (I)-1 (2 parts by mass) were mixed, and then diluted with methyl ethyl ketone so that the concentration of the solid content reached 45 mass%, and a combination for forming a thermosetting protective film was obtained. substance (III-1). It should be noted that the compounding amounts of components other than methyl ethyl ketone shown here are all solid content amounts.

[0438] (Formation of film for protective film formation)

[0439] On the above-mentioned release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickne...

Embodiment 2

[0448] In the formation of the adhesive layer, the application amount of the adhesive composition (I-4)-1 was changed to form a non-energy ray curable adhesive layer Ad2 with a thickness of 20 μm instead of 5 μm, and support was obtained. Sheet Ss2, and using the obtained support sheet Ss2, according to the method similar to Example 1, the composite sheet for protective film formation was manufactured.

[0449] That is, the protective film-forming composite sheet is laminated in the thickness direction of the substrate Bm1, the adhesive layer Ad2, the protective film-forming film Pf1, and the release film in the order of their thickness. The surface on one side of the agent layer Ad2 is a smooth surface, and the surface (exposed surface) on the opposite side to the side provided with the adhesive layer Ad2 of the base material Bm1 is an uneven surface. Table 1 shows the composition of the composite sheet for forming a protective film.

Embodiment 3

[0451] (manufacture of adhesive composition)

[0452] Adhesive resin (i)-2 (100 parts by mass) and toluene diisocyanate crosslinking agent ("BHS8515" manufactured by TOYOCHEM Co., Ltd.) (10 parts by mass) were mixed, and then diluted with methyl ethyl ketone so that the concentration of the solid content was 35 % by mass and a non-energy ray curable adhesive composition (I-4)-2 was obtained. It should be noted that the compounding amounts of components other than methyl ethyl ketone shown here are all solid content amounts.

[0453] (Formation of adhesive layer, production of support sheet)

[0454] Apply the adhesive composition (I-4)-2 obtained above on the smooth surface of the above-mentioned substrate Bm1 with a surface roughness of 0.05 μm, and dry at 100° C. for 1 minute to form a non-energy sheet with a thickness of 5 μm. The support sheet Ss3 was obtained from the line-curable adhesive layer Ad3.

[0455] (Manufacture of composite sheets for protective film formati...

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Abstract

This supporting sheet comprises a base and an adhesive layer that is laminated on the base. The surface roughness (Ra) of the adhesive layer-side surface of the base is 0.4 [mu]m or less; and the surface roughness (Ra) of another surface of the base, said another surface being on the reverse side of the adhesive layer-side surface, is larger than the surface roughness of the adhesive layer-side surface, while being 0.053-0.48 [mu]m. A composite sheet for protective film formation according to the present invention is provided with this supporting sheet, and additionally comprises, on the adhesive layer of the supporting sheet, a film for protective film formation.

Description

technical field [0001] The present invention relates to a support sheet and a composite sheet for forming a protective film. [0002] This application claims priority based on Japanese Patent Application No. 2016-060577 for which it applied in Japan on March 24, 2016, and uses the content here. Background technique [0003] In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In the flip-chip method, a semiconductor chip having electrodes such as bumps on a circuit surface, which is bonded to a substrate, can be used. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed. [0004] A resin film made of an organic material is formed as a protective film on the back surface of the exposed semiconductor chip, and a semiconductor chip with a protective film obtained by forming the protective film in this way may be mounted in a semiconductor device. The protecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301B32B3/30B32B27/00C09J201/00C09J7/20
CPCB32B27/00B32B3/30C09J201/00C09J7/20B32B5/145B32B7/06B32B7/12B32B27/08B32B27/20B32B27/308B32B27/32B32B27/38B32B2307/538B32B2270/00
Inventor 小桥力也
Owner LINTEC CORP