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Film for forming protective film, and composite sheet for forming protective film

A technology of protective film and composite sheet, applied in the direction of film/sheet without carrier, film/sheet adhesive, manufacturing tool, etc.

Inactive Publication Date: 2018-12-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, neither the energy ray-curable protective film disclosed in Patent Document 1 nor the energy ray-curable chip protective film disclosed in Patent Document 2 is intended to clearly perform laser printing on the protective film.

Method used

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  • Film for forming protective film, and composite sheet for forming protective film
  • Film for forming protective film, and composite sheet for forming protective film
  • Film for forming protective film, and composite sheet for forming protective film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0237] >

[0238] The composition for protective film formation, such as the composition for protective film formation (IV-1), can be obtained by blending each component for constituting it.

[0239] The order of addition when blending each component is not specifically limited, Two or more components may be added simultaneously.

[0240] When a solvent is used, it may be used by pre-diluting the blended ingredients by mixing the solvent with any blended ingredients other than the solvent, or may be used by mixing the solvent and any blended ingredients without pre-diluting any blended ingredients except the solvent. These blending components are mixed and used.

[0241] The method of mixing the components at the time of blending is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer or a stirring blade; a method of mixing by using a stirrer; and mixing by applying ultrasonic waves. method etc...

Embodiment 1

[0354]

[0355] (Preparation of protective film-forming composition (IV-1))

[0356] Energy ray curable component (a2)-1, polymer (b)-1, photopolymerization initiator (c)-1, photopolymerization initiator (c)-2, filler (d)-1, coupling Agent (e)-1 and colorant (g)-1 were dissolved or dispersed in methyl ethyl ketone so that their contents (solid content, parts by mass) became the values ​​shown in Table 1, and heated at 23° C. Stirring was performed to prepare a protective film-forming composition (IV-1) having a solid content concentration of 50% by mass. In addition, description of "-" in the column containing a component in Table 1 means that the composition for protective film formation (IV-1) does not contain this component.

[0357] (Manufacture of protective film forming film and protective film forming composite sheet)

[0358] Using a knife coater, the protective film-forming composition (IV-1) obtained above was coated on the surface of the substrate (11)-1 on the ...

Embodiment 2

[0372] Except having used base material (11)-2 instead of base material (11)-1, the film for protective film formation and the composite sheet for protective film formation were produced by the method similar to Example 1, and the protective film was evaluated. The protective film-forming composition (IV-1) was applied to the surface of the substrate (11)-2 on the side where the maximum cross-sectional height (Rt) was 8.0 μm. The results are shown in Table 2.

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Abstract

This film for forming a protective film is energy ray curable. When the film for forming the protective film is irradiated with energy rays to form the protective film, the maximum cross-sectional height (Rt) of at least one surface ([beta]') of the protective film is less than 10 [mu]m. This composite sheet for forming the protective film is provided with a support sheet, and has, provided on thesupport sheet, the film for forming the protective film. When the film for forming the protective film is irradiated with energy rays to form the protective film, the surface ([beta]) of the film forforming the protective film which becomes the surface ([beta]') of the protective film faces the support sheet.

Description

technical field [0001] The present invention relates to a film for protective film formation and a composite sheet for protective film formation. [0002] This application claims priority based on Japanese Patent Application No. 2016-092008 for which it applied in Japan on April 28, 2016, and uses the content here. Background technique [0003] In recent years, semiconductor devices using a mounting method called a so-called face down method are being manufactured. In the flip-chip method, a semiconductor chip having electrodes such as bumps on a circuit surface, and the electrodes are bonded to a substrate is used. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed. [0004] A resin film containing an organic material is formed as a protective film on the back surface of the exposed semiconductor chip, and this may be incorporated into a semiconductor device as a semiconductor chip with a protective film. Protective films...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10H01L21/304B32B3/26C09J201/02H01L21/301B23K26/00C09J7/20
CPCB23K26/00B32B3/26C09J201/02H01L21/304C09J7/20
Inventor 稻男洋一小桥力也
Owner LINTEC CORP