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Loudspeaker and manufacturing method of loudspeaker

A production method and speaker technology, which is applied in the field of acoustics and electricity, can solve the problems of speaker miniaturization and waste of space, and achieve the effects of reducing the number of welding processes, reducing the volume, and reducing the number of pads

Inactive Publication Date: 2020-11-17
AAC TECH PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the related art, the conductive end of the loudspeaker includes a flexible circuit board and a conductive part. In the process of making the speaker, the flexible circuit board is first welded to the basin frame, and then the conductive part is welded to the flexible circuit board. Using this manufacturing method, it is necessary to Setting two pad positions wastes space and does not meet the needs of speaker miniaturization

Method used

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  • Loudspeaker and manufacturing method of loudspeaker
  • Loudspeaker and manufacturing method of loudspeaker
  • Loudspeaker and manufacturing method of loudspeaker

Examples

Experimental program
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Effect test

Embodiment 1

[0032] See figure 1 and figure 2 , The present invention provides a speaker 100, which includes a housing with a housing space 1, a vibration system housed in the housing space 2, a magnetic circuit system 3 for driving the vibration system 2 to vibrate and produce sound, and an elastic support The flexible circuit board 4 of the vibration system 2 and the conductive terminals 5 connected to the flexible circuit board 4 are described.

[0033] The housing 1 includes an upper cover 11 and a basin frame 12 assembled with the upper cover 11 to form the receiving space. The basin frame 12 includes a basin frame body 121 and an extension 122 extending from the basin frame body 121 in a direction away from the vibration system 2, and the upper cover 11 is provided on the basin frame body 121 away from the extension. One side of section 122.

[0034] The basin frame body 121 is in the shape of a rectangular frame, which includes two long side walls 1211 arranged in parallel and two shor...

Embodiment 2

[0048] See Figure 4 and Figure 5 , The present invention also provides a method for manufacturing the speaker 100, which includes the following steps:

[0049] S1: Provide a housing 1, a vibration system 2 accommodated in the accommodation space, and a magnetic circuit system 3 for driving the vibration system 2 to vibrate and produce sound.

[0050] See Image 6 and Figure 7 The housing 1 includes an upper cover 11 and a basin frame 12 assembled with the upper cover 11 to form the receiving space. The housing 1 is used to house and protect other components of the speaker.

[0051] The basin frame 12 is in the shape of a rectangular frame, and includes a basin frame body 121 and an extension 122 extending from the basin frame body 121 in a direction away from the vibration system 2. The upper cover 11 covers the basin frame A side of the main body 121 away from the extension 122.

[0052] The basin frame body 121 includes two long side walls 1211 arranged in parallel and two short...

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Abstract

The invention provides a loudspeaker. The loudspeaker includes a housing, a vibration system housed in the housing, a magnetic circuit system, a flexible circuit board, and conductive terminals. The housing includes an upper cover and a frame. The frame includes a frame body and an extension. A card slot is formed by inwardly recessing toward the side of the receiving space and a through hole is recessed from the top of the extension part and communicated with the card slot. One end of the flexible circuit board is accommodated in the card slot, and the conductive terminal is fixedly connected to the flexible circuit board through the through hole. The invention also provides a manufacturing method of the loudspeaker. The loudspeaker provided by the present invention is provided with a through hole and a slot connected to the through hole in the extension of the basin frame, and one end of the flexible circuit board is accommodated in the slot, and the conductive terminal is fixedly connected to the flexible circuit board directly through the through hole. The fixing of the flexible circuit board and the conductive terminals can be realized by one welding, which reduces the number of welding pads in the production process of the speaker, and can reduce the volume of the speaker.

Description

【Technical Field】 [0001] The invention relates to the field of sound and electricity, in particular to a speaker and a method for manufacturing the speaker. 【Background technique】 [0002] In order to adapt to the development of miniaturization and multifunctionalization of various audio equipment and information communication equipment, the speakers used in this type of equipment need to be more miniaturized and more compact in coordination with other components around the speakers. [0003] In the related art, the conductive end of the speaker includes a flexible circuit board and conductive parts. In the process of manufacturing the speaker, the flexible circuit board is first welded to the frame, and then the conductive parts are welded to the flexible circuit board. Setting two pad positions wastes space and does not meet the needs of speaker miniaturization. [0004] Therefore, it is necessary to provide a speaker and a method for manufacturing the speaker to solve the above t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R9/06H04R9/02H04R31/00
CPCH04R9/02H04R9/06H04R31/003H04R2231/001H04R2400/11H04R1/06H04R7/04H04R9/025H04R9/045H05K1/0278H05K2201/10083H05K1/0277H05K7/1427H05K2201/10189
Inventor 冯岱
Owner AAC TECH PTE LTD