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Semiconductor memory devices, memory systems including semiconductor memory devices

A memory and semiconductor technology, applied in static memory, read-only memory, digital memory information, etc., can solve the problems of increasing the size of semiconductor memory and increasing the manufacturing cost of semiconductor memory

Active Publication Date: 2019-05-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the number of pads increases, the size of the semiconductor memory may increase, and thus the manufacturing cost of the semiconductor memory may increase

Method used

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  • Semiconductor memory devices, memory systems including semiconductor memory devices
  • Semiconductor memory devices, memory systems including semiconductor memory devices
  • Semiconductor memory devices, memory systems including semiconductor memory devices

Examples

Experimental program
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Embodiment Construction

[0047] Embodiments of the inventive concepts may be described in detail and clearly below so that those of ordinary skill in the art can realize the embodiments of the inventive concepts.

[0048] figure 1 is a block diagram illustrating a memory system 10 according to an embodiment of the inventive concept. refer to figure 1, the memory system 10 may include a controller 20 and a semiconductor memory device 100 (also referred to herein as a semiconductor memory 100). For example, the semiconductor memory 100 may include Dynamic Random Access Memory (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), and Low Power DDR SDRAM (LPDDR SDRAM).

[0049] The controller 20 may communicate with the semiconductor memory 100 through the first to sixth controller pads 21 to 26 . The semiconductor memory 100 may communicate with the controller 20 through the first to sixth memory pads 101 to 106 . As described herein, each of the second controller pad 22 to the sixth ...

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PUM

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Abstract

A semiconductor memory device includes a memory core that performs reading and writing of data, data delivery and training blocks that are connected between first pads and the memory core, and at least one data delivery, clock generation and training block that is connected between at least one second pad and the memory core. In a first training operation, the data delivery and training blocks output first training data, received through the first pads, through the first pads as second training data. In a second training operation, at least one of the data delivery and training blocks outputsthird training data, received through the at least one second pad, through at least one of the first pads as fourth training data. The second training data and the fourth training data are output in synchronization with read data strobe signals output through the at least one second pad.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2017-0140363 filed with the Korean Intellectual Property Office on October 26, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments of the inventive concept described herein relate to a semiconductor memory device (also referred to herein as a semiconductor memory), and more particularly, to a semiconductor memory, a memory system including the semiconductor memory, and a method of operating the semiconductor memory. Background technique [0004] Semiconductor memory devices are used in various electronic devices. Semiconductor memory devices can be used to store data for operation of electronic devices. In addition, semiconductor memory may be used to load executable code for an electronic device, such as an operating system, firmware, software, and the like. [0005] As the quality of conten...

Claims

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Application Information

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IPC IPC(8): G11C16/32
CPCG11C16/32G11C5/025G11C7/106G11C7/1087G11C7/1093G11C11/4076G11C29/028G11C2207/105G11C2207/107G11C2207/2254G11C7/1066G11C11/4093G11C7/222G11C7/1006G11C7/22G11C11/4091
Inventor 金荣勋金始弘
Owner SAMSUNG ELECTRONICS CO LTD