Unlock instant, AI-driven research and patent intelligence for your innovation.

An electroplating device and electroplating equipment

A technology of electroplating device and electroplating pool, which is applied in the direction of current conduction device, contact device, electrolysis process, etc. It can solve the problems of poor consistency of electroplating effect on circuit boards, and achieve the effects of avoiding inconsistent electroplating time, ensuring copper thickness, and improving consistency

Inactive Publication Date: 2018-11-16
UNIVERSAL CIRCUIT BOARD EQUIP CO LTD
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an electroplating device, which aims to solve the technical problem of poor consistency in the electroplating effect of the same batch of circuit boards in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An electroplating device and electroplating equipment
  • An electroplating device and electroplating equipment
  • An electroplating device and electroplating equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0023] In the description of the present invention, it should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "hor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electroplating device and electroplating equipment are provided. The electroplating device cooperates with an electroplating bath to perform electroplating on circuit boards. The electroplating device includes a drive mechanism, a mounting element in drive connection with the driving mechanism and made of an electrically conductive material, and a plurality of clamps fixedly mounted on the mounting element to clamp the circuit boards. The clamps are made of an electrically conductive material, and each clamp is electrically connected to the mounting element. The mounting element is suspended above the electroplating bath. The clamps and the circuit boards clamped by the clamps are fixed to the mounting element. The drive mechanism is used for driving the mounting element so that the mounting element drives the clamps and the circuit boards to move together and the circuit boards are moved into the electroplating bath. The electroplating device can avoid a situation that electroplating time of the circuit boards is different and allows voltage, current and electroplating time of the circuit boards to be same respectively, thus improving uniformity of electroplating effects of thecircuit boards and further ensuring that copper thicknesses of the electroplated circuit boards in a same batch are same.

Description

technical field [0001] The invention belongs to the technical field of circuit board production equipment, and in particular relates to an electroplating device and electroplating equipment. Background technique [0002] Electroplating is the use of electrolysis to attach a layer of metal film to the surface of metal or other material parts. In the field of circuit board production, it is usually necessary to use electroplating technology to perform copper deposition on circuit boards. [0003] Electroplating equipment generally includes a drive mechanism, a transmission mechanism connected to the drive mechanism, a fixture fixed on the transmission mechanism and used to clamp the circuit board, and an electroplating pool for electroplating reaction. The drive mechanism drives the clamp to the fixture through the transmission mechanism. The circuit boards on the board enter the electroplating pool for electroplating reaction. When the existing electroplating equipment electr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D17/06C25D17/00C25D7/00
CPCC25D7/00C25D17/00C25D17/005C25D17/007C25D17/06
Inventor 陈德和
Owner UNIVERSAL CIRCUIT BOARD EQUIP CO LTD