Probe structure and using method thereof
A probe and predetermined length technology, applied in the field of probe structure, can solve the problems of re-planting and shortening of the tip section of the probe, so as to improve utilization rate, reduce the frequency of re-planting, and prolong the service life Effect
Inactive Publication Date: 2018-11-20
HUAIAN IMAGING DEVICE MFGR CORP
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Problems solved by technology
[0005] The purpose of the present invention is to design a probe structure and its use method to solve the problem of using the probe in the prior art for wafer acceptance testing, the wear of the tip section of the probe becomes shorter, and high-frequency re-planting of needles is required. question
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[0023] The structure of the probe proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific examples. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0024] The maintenance method of the probe in the prior art and the maintenance method of the probe of the present invention are compared and analyzed. Wherein, in the prior art, aiming at the problem that the tip section of the probe is worn and shortened in the wafer acceptance test, the probe increases the length of the tip section by implanting needles. However, in the present invention, the stretching device is used to push out the length of the apex section nested therein...
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The invention designs a probe structure and a using method thereof. The probe structure comprises a tip segment, a body and a stretching device, and the stretching device is arranged in the tip segment and is connected with the body. On the basis of the probe structure, the length change of the tip end of the probe structure is monitored, and every time the tip segment is reduced for a predetermined length, the stretching device pushes out the tip segment for the predetermined length till the residual of the tip segment cannot be pushed out for the predetermined length. Via the probe structure, the problem of length reduction of the tip segment is solved, the stretching device pushes the tip segment to make up the length reduced due to wearing, the length requirement for the tip segment inthe test process is met, the service life of the probe structure is prolonged, the frequency of probe reinstallation is reduced, and the probe utilization rate is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a probe structure and an application method thereof. Background technique [0002] The manufacturing process of integrated circuits can be divided into three stages: upstream, middle and downstream, including silicon wafer production; integrated circuit production; integrated circuit packaging and testing. The manufacturing process of integrated circuits is very complicated and the cost is very high, so the yield rate of manufactured products plays a decisive role. The test in the whole production process is roughly divided into three stages: the wafer acceptance test (WaferAcceptance Test, WAT) after the integrated circuit is manufactured; the test before the integrated circuit package (ChipPackage Test); the test after the integrated circuit package (Final Test). [0003] Wafer Acceptance Test (WAT) is an electrical test of the chip after the process is completed, and ...
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IPC IPC(8): G01R1/067G01R31/26
CPCG01R1/067G01R31/26
Inventor 张鸣帆叶定文
Owner HUAIAN IMAGING DEVICE MFGR CORP