Method for improving laminating alignment precision of circuit board and adhesive tape
A technology of alignment accuracy and circuit board, applied in printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve the problems of difficult rework and low precision of tape bonding position, and achieve the effect of avoiding rework
Active Publication Date: 2018-11-20
JIANGMEN SUNTAK CIRCUIT TECH
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Embodiment
[0031] This embodiment provides a method for improving the alignment accuracy of the adhesive tape on the circuit board. The adhesive tape needs to be pasted on the designated area of the circuit board, and the pattern corresponding to this area is called the adhesive pattern. The specifications of the circuit board are as follows:
[0032]
[0033] Specific steps are as follows:
[0034] (1) According to the existing circuit board production technology, the inner layer board is made after cutting the material, inner layer circuit making and inner layer AOI in sequence; the inner layer board and the outer layer copper foil are pressed together through the prepreg to form a multi-layer Produce the board, and then carry out outer layer drilling, copper sinking and full board electroplating on the production board in sequence, make the outer layer circuit, make the solder resist layer, surface treatment and electrical test, and make the circuit board.
[0035] (2) Make the ...
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The invention relates to the technical field of circuit board manufacturing, in particular to a method for improving laminating alignment precision of a circuit board and an adhesive tape. A glue pasting auxiliary plate provided with fixed pins is used, and the circuit board and the adhesive tape are sequentially fixed on the glue pasting auxiliary plate through the fixed pins, so that the adhesive tape and the circuit board are accurately aligned, thereby further reducing / avoiding reworking caused by inaccurate glue pasting positions. The adhesive tape is firstly cut according to a glue pasting pattern to form a tearing area and a pattern area, and a release film at the pattern area is torn off before the adhesive tape is laminated on the circuit board, so that the pattern area and the circuit board are attached together during lamination, and the tearing area with the release film which is not torn off can be easily removed after lamination. A single-sided adhesive tape is attached to a protective film of the adhesive tape, so that the relative position of the pattern area and the tearing area can be temporarily fixed, and it is ensured that pattern area and the tearing area cannot be separated from each other before the areas are torn off by manpower.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for improving the positioning accuracy of a circuit board adhesive tape. Background technique [0002] With the development of science and technology, intelligence, lightness and simplicity have become the mainstream of electronic product design. Among them, in the installation and fixing process of electronic products, many end customers no longer use traditional drilling and screwing methods for fixing, but use tape, especially 3M tape for fast bonding and fixing, which is fast and simple. , Thin features. Based on this trend, some circuit board products are required to be pasted with 3M tape at a specific position when they are shipped, so that customers can quickly mount and fix them, such as figure 1 shown. [0003] The 3M tape on the circuit board is generally after the tape is cut and the window is opened, and the 3M tape is manually pasted on ...
Claims
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IPC IPC(8): H05K3/30
CPCH05K3/303H05K2203/166H05K2203/167
Inventor 黄力王海燕寻瑞平杨润伍
Owner JIANGMEN SUNTAK CIRCUIT TECH