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LED aluminum substrate

A technology of LED aluminum substrate and aluminum substrate is applied in the field of LED lighting, which can solve the problems of inconvenient installation and unfavorable heat dissipation, and achieve the effects of eliminating substrate damage, facilitating heat dissipation, and facilitating repeated use.

Inactive Publication Date: 2018-11-23
王回芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing LED aluminum substrates are all single-layer, which is not conducive to heat dissipation, and the electronic components are all welded, and the power supply is separated from the aluminum substrate, which is inconvenient to install

Method used

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  • LED aluminum substrate
  • LED aluminum substrate
  • LED aluminum substrate

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Embodiment Construction

[0014] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0015] Such as Figure 1 to Figure 4 As shown, the LED aluminum substrate includes a collection board 1 and an aluminum substrate 3, the collection board 1 is connected to the aluminum substrate 3 through a plurality of studs 2, the collection board 1 is provided with a number of upper mounting holes 11, the The aluminum base plate 3 is provided with several lower installation holes 31, and the buckle column 2 is connected with the upper installation hole 11 and the lower installation hole 31. Body 23, a pressure sheet 24 and a spiral sheet 25.

[0016] The buckle post 2 is integrally formed by nylon. The pointed head 21 is triangular in shape....

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Abstract

The invention discloses an LED aluminum substrate which comprises an integration plate and an aluminum substrate body. The integration plate is connected with the aluminum substrate body through a plurality of buckling columns, the integration plate is provided with a plurality of upper installing holes, the aluminum substrate body is provided with a plurality of lower installing holes, the upperinstalling holes and the lower installing holes are connected through the buckling columns, and each buckling column sequentially comprises a cusp, an ejecting sheet, a column body, a pressure bearingsheet and a spiral sheet from top to bottom. The LED aluminum substrate has the following advantages that in the using process, the integration plate is provided with a plurality of electronic component grooves, electronic components in different manners are met, substrate damage caused by welding is avoided, installation is convenient, reuse is facilitated, and the aluminum substrate can be spliced. The integration plate is connected with the aluminum substrate body through the buckling columns, a space can be formed above the aluminum substrate body, heat radiating is facilitated compared with single-layer aluminum substrate bodies, and the LED aluminum substrate is particularly suitable for installing a high-power LED.

Description

technical field [0001] The invention relates to the technical field of LED lighting, more precisely, it relates to a safe LED aluminum substrate. Background technique [0002] The advent of LED aluminum substrate products has opened the development of the heat dissipation application industry. Due to the excellent heat dissipation of LED aluminum substrates, coupled with the advantages of low thermal resistance, long life, and voltage resistance of aluminum substrates, with the improvement of production technology and equipment, product prices have accelerated and rationalized. And then expand the application field of LED industry. The existing LED aluminum substrates are all single-layer, which is not conducive to heat dissipation, and the electronic components are all welded, and the power supply is separated from the aluminum substrate, which is inconvenient to install. Contents of the invention [0003] The present invention mainly solves the technical problems ex...

Claims

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Application Information

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IPC IPC(8): F21K9/20F21V19/00F21V23/00F21V23/06F21Y115/10
CPCF21V19/001F21V23/004F21V23/06
Inventor 王回芳
Owner 王回芳