Heat dissipating device
A technology of heat dissipation device and heat sink, which is applied in the direction of circuit heat device, printed circuit components, etc., which can solve problems such as damage, insufficient heat dissipation capacity of ordinary circuit boards, and reduced efficiency of IC chips, so as to achieve the effect of improving heat dissipation efficiency
Pending Publication Date: 2018-11-23
SHENZHEN DICOLOR OPTOELECTRONICS
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Problems solved by technology
[0002] The IC chips in the prior art are directly soldered to the circuit board, and then the heat emitted by the IC chip is dissipated through the circuit board. When the power of the IC chip is large, a large amount of heat will be generated. The heat dissipation capacity of the ordinary circuit board is not enough, which will cause the IC If the chip is overheated and the efficiency is reduced or damaged, the distance between adjacent IC chips is too close, and the heat between the IC chips will be superimposed on each other, so it is easy to form a "heat island effect". Therefore, it is necessary to arrange and coordinate high-power IC chips The heat dissipation of the PCB board is improved
Method used
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[0020] The following will clearly and completely describe the technical solutions of each exemplary embodiment provided in the present application with reference to the accompanying drawings in the embodiments of the present application. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.
[0021] Please also refer to Figure 1 ~ Figure 3 ,like figure 1 As shown, this embodiment provides a heat dissipation device, which is used to dissipate heat from the IC chip 3 arranged on the circuit board 1, and the heat dissipation device specifically includes: a circuit board 1 and a plurality of chips arranged on the circuit board 1 The pre-installation position 2, wherein the size of the chip pre-installation position 2 on the same circuit board 1 can be different, depending on the size of the IC chip 3 to be installed on each chip pre-installation position 2. Wherein, the material and the number of layers of the cir...
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The invention discloses a heat dissipating device. The heat dissipating device is used for dissipating heat of IC chips disposed on a circuit board, and the heat dissipating device comprises the circuit board and a plurality of chip pre-installing positions disposed on the circuit board. The chip pre-installing positions each comprise a mounting seat and bonding pads disposed on the periphery of the mounting seat, and the mounting seats are provided with heat dissipating grooves and heat conducting columns. The heat conducting columns and the heat dissipating grooves are arranged at intervals.The bonding pads are used for soldering pins of the IC chips, the heat conducting columns are used for conducting the heat generated by the IC chips during work, and the heat dissipating grooves areused for dissipating the heat on the circuit board and the IC chips. The heat dissipating device is simple in structure and good in heat dissipation effect.
Description
technical field [0001] The present application relates to the technical field of circuit boards, in particular to a heat dissipation device. Background technique [0002] The IC chips in the prior art are directly soldered to the circuit board, and then the heat emitted by the IC chip is dissipated through the circuit board. When the power of the IC chip is large, a large amount of heat will be generated. The heat dissipation capacity of the ordinary circuit board is not enough, which will cause the IC If the chip is overheated and the efficiency is reduced or damaged, the distance between adjacent IC chips is too close, and the heat between the IC chips will be superimposed on each other, so it is easy to form a "heat island effect". Therefore, it is necessary to arrange and coordinate high-power IC chips The heat dissipation of the PCB board is improved. Contents of the invention [0003] The technical problem mainly solved by this application is to provide a heat dissi...
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Login to View More IPC IPC(8): H05K1/02
CPCH05K1/0203
Inventor 吴明金孟德首徐陈爱
Owner SHENZHEN DICOLOR OPTOELECTRONICS