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A laser processing analysis device and method with self-learning function

A laser processing and self-learning technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as poor self-adaptability, complicated adjustment process, time-consuming and labor-intensive problems

Active Publication Date: 2020-10-30
INNO LASER TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing laser processing, most of them need to be adjusted frequently by experimenters or manually, and when the processing object or processing environment changes, it needs to be readjusted from the initial stage, and the adjustment process is complicated, and a single device needs to be debugged. Then run the equipment as a whole, and carry out the debugging of the coordinated operation of each component. The whole process requires the operator to have corresponding professional knowledge and strong hands-on ability, and it is time-consuming and labor-intensive. The use process cannot be automated and intelligent. Adjustment, poor adaptive ability

Method used

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  • A laser processing analysis device and method with self-learning function
  • A laser processing analysis device and method with self-learning function
  • A laser processing analysis device and method with self-learning function

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Experimental program
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Effect test

Embodiment 1

[0046] like figure 1 As shown, a kind of laser processing analysis device with self-learning function of an embodiment of the present invention is provided, including:

[0047] The first acquisition module A101 is used to acquire the processing information input by the user. The processing information includes the name of the target workpiece, the names of each part of the target workpiece, the thickness of each part of the target workpiece, the processing method of each part of the target workpiece, and the thickness of each part of the target workpiece. Processing speed, processing accuracy of the target workpiece and processing quality corresponding to each processing method of the target workpiece (such as heat-affected zone size, taper, etc.), the target workpiece is the workpiece to be processed, and the processing speed is the speed of laser processing the target workpiece;

[0048] The first acquisition module A101 also acquires processing data by recognizing voice or ...

Embodiment 2

[0066] like image 3 As shown, a kind of laser processing analysis method with self-learning function of an embodiment of the present invention is provided, comprising the following steps:

[0067] S301 Obtain the processing information input by the user. The processing information includes the name of the target workpiece, the names of each part of the target workpiece, the thickness of each part of the target workpiece, the processing method of each part of the target workpiece, the processing speed of each part of the target workpiece, and the processing of the target workpiece. Accuracy and processing quality corresponding to each processing method of the target workpiece (such as heat-affected zone size, taper, etc.), the target workpiece is the workpiece to be processed, and the processing speed is the speed of laser processing the target workpiece.

[0068] The way of obtaining the processing information input by the user also includes obtaining the processing data by r...

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Abstract

The invention provides a laser processing analysis device and method with a self-learning function. The device comprises a first acquisition module used for acquiring processing information input by auser, a first processing and analysis module used for carrying out comparison according to the processing information and historical processing information to acquire overlapping features and carrying out self-learning on data of the overlapping features so as to output processing parameters, a second acquisition module used for acquiring correction information obtained after the user carries outtesting according to the processing parameters and the processing information, a correction module used for carrying out self-learning according to the correction information so as to adjust the first processing and analysis module and a database used for storing the processing information, the processing parameters, the correction information and the historical processing information. The laserprocessing process is more intelligent and automatic, accuracy of laser processing data collection can be greatly improved, the link of manual repeated testing is reduced, and the work efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing analysis device and method with self-learning function. Background technique [0002] In the existing laser processing, most of them need to be adjusted frequently by experimenters or manually, and when the processing object or processing environment changes, it needs to be readjusted from the initial stage, and the adjustment process is complicated, and a single device needs to be debugged. Then run the equipment as a whole, and carry out the debugging of the coordinated operation of each component. The whole process requires the operator to have corresponding professional knowledge and strong hands-on ability, and it is time-consuming and labor-intensive, and the use process cannot be automated and intelligent. Adjustment, poor self-adaptive ability. Contents of the invention [0003] Aiming at the shortcomings of the existing methods, the present...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/70
CPCB23K26/00B23K26/702
Inventor 赵晓杰陶沙秦国双
Owner INNO LASER TECH CORP LTD
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